Latest MOSFET and Chip Thinning Process, On-resistance Down 47%
Excellent ease of use and scalability, includes advanced protection features

Infineon has introduced the MOTIX™ single half-bridge IC family, ideal for automotive applications, featuring 47% lower on-resistance in a package 60% smaller than the previous generation.

Infineon Technologies (Korea CEO Seung-soo Lee) announced on the 25th the launch of the intelligent integrated half-bridge product family MOTIX™ BTN99xx (NovalithIC™+).

With Infineon's latest MOSFET technology and chip thinning process, the current limit of the BTN99xx was increased to 75A while the path resistance was lowered by 47% to 5.30mΩ (typ, @25°C).

The BTN99xx, the successor to the BTN89xx, integrates p-channel high-side and n-channel low-side MOSFETs and a smart driver IC in a single package.

The new product is implemented in a robust package using Infineon's chip-by-chip and chip-on-chip assembly technologies.

BTN99xx is suitable for applications that require reduced PCB area by integrating various functions into a robust single package. />
In addition, this product family offers excellent ease of use and scalability, and is ideal for various automotive applications as it includes advanced protection features.

In addition, recognized for its reliability, it is also suitable for applications such as seat control, electric trunk and sliding door, and fuel pump.

The BTN99xx is a very compact, cost-optimized, and differentiated solution for high-current PWM motor drives.

The BTN99xx product family consists of BTN9970LV and BTN9990LV and is available in a 7mm x 8mm HSOF-7 package.

Mass production of the BTN9970LV has begun, and the BTN9990LV is scheduled for release in February 2022.