Analog Devices is raising expectations that it will reduce the number of components required for 5G wireless by releasing a millimeter wave (mmW) 5G chipset that enables small and simple wireless system designs.


Analog Devices announced on the 31st that it has released a millimeter wave (mmW) 5G front-end chipset capable of handling the frequency bands required for applications, enabling designers to implement wireless systems with various functions more compactly and simply and accelerate product launch.

This chipset consists of four highly integrated ICs and provides a complete solution that significantly reduces the number of components required for 24–47 GHz 5G wireless.

The new chipset consists of two single-channel (1T1R) up/down converters (UDCs) fabricated using an advanced CMOS process and two dual-polarized 16-channel beamformer devices.

This beamformer offers excellent power efficiency and linear output characteristics, enabling reductions in the size, weight, power, and cost of millimeter-wave phased array designs compared to using competing solutions.

Full-band UDC has a high drive level, eliminating the need to change the frequency band, and includes a driver stage, allowing for a reduction in the bill of materials (BOM).

In addition to non-volatile memory (NVM) that ships factory-calibrated, this chipset can seamlessly perform phase array calibration functions online in the field thanks to patented IP.

Therefore OEM can overcome the design constraints of legacy NVM, where calibration opportunities are limited to once at the time of beamformer factory shipment.