Congatec Korea, a leading company in embedded and edge computing technology, has expanded its portfolio with the power-efficient 12th generation Intel Core IOTG (Internet of Things Group) mobile processor (Alder Lake).

Congatec announced on the 28th that it will be releasing 14 new products in total, including 7 new COM-HPC and 7 COM Express computer-on-modules that use Intel's 12th generation Core Alder Lake.

The new conga-HPC/cALP COM-HPC Client Size A module (95x120mm) and the conga-TC670 COM Express Type 6 Compact module (95x95mm) are available with six energy-efficient 12th generation Intel Core processors and cost-optimized Celeron processors.

Both modules support up to 64GB of ultra-fast DDR5 SO-DIMM memory at 4,800MT/s.

Differentiated graphics support for up to four independent displays at up to 8k resolution is provided via integrated Intel Iris Xe graphics for Intel Core i7 and i5 processors, and Intel UHD Graphics for Intel Core i3 and Intel Celeron.

The COM-HPC module supports up to 16 Gen 4 PCIe lanes, up to 8 Gen 3 PCIe lanes, and up to 2 Thunderbolt ports to connect high-bandwidth peripherals.

Additionally, the COM Express model supports up to eight Gen 4 PCIe lanes and up to eight Gen 3 PCIe lanes, and both the COM-HPC module and COM Express offer ultra-fast NVMe SSDs as an option.

For mounting additional storage devices, COM-HPC includes two 3rd generation SATA slots.

The COM-HPC module provides 2x 2.5 GbE for networking, while the COM Express module provides 1x 2.5 GbE, and both modules support TSN.

Sound is provided via SoundWire, the COM-HPC version via HDO or I2S, and the COM Express module via HDA.

Comprehensive board support packages are provided for all major real-time operating systems (RTOS), including hypervisor support from Realtime Systems for major RTOS including Linux, Windows, and Android.