As smartphone features diversify to meet consumer demands, the architectural and PCB design challenges have steadily increased. Consumers demand more advanced devices that support both Bluetooth and Wi-Fi 6 performance. This means that a satisfying smartphone must offer improved features over previous generations, including low latency and high network capacity and efficiency.

NXP Semiconductors announced on the 14th that its WLAN7207H 2.4GHz front-end integrated circuit (FEIC) will enable Wi-Fi 6 in Chinese smartphone manufacturer Honor's flagship Magic V smartphone. The NXP WLAN7207x single FEM family provides routing and printed circuit board (PCB) design flexibility to enable optimized RF performance in smartphones.

The WLAN7207x single FEM family provides designers with extensive routing and PCB layout freedom to optimize RF to support higher Wi-Fi 6 and Bluetooth performance.

“As consumers become increasingly reliant on their smartphones to enjoy the ever-increasing number of data-driven benefits, the amount of data that needs to be transmitted and the number of devices across them are rapidly increasing,” said Doeko Terpstra, vice president and general manager of Smart Antenna Solutions at NXP. “Wi-Fi 6 is our answer to this challenge, and our FEIC solution delivers the Wi-Fi 6 performance benefits consumers want while providing OEMs with the design flexibility they need.”

“As smartphones become more feature-rich, form factor has become a differentiator for consumers,” said George Zhao, Honor CEO. “NXP’s FEM solutions enable us to overcome the increasing complexity and challenges of flagship phone designs while delivering the longer transmission range and improved signal quality associated with Wi-Fi 6.”