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[KES 2022] KETI Unveils Mid-Term Collaborative R&D Results

Google 우선 소스Published2022.10.07 09:31




KETI's Industry-Research Cooperation Center provides business consultations to promote technology commercialization.

The Korea Electronics Technology Institute (KETI, President Shin Hee-dong) showcased the R&D technology achievements of its joint collaboration with promising domestic small and medium-sized enterprises (SMEs) at the Korea Electronics Show (KES 2022).

The Electronics and Telecommunications Research Institute (KERI) operated a 'KETI Industry-Research Cooperation Hall' booth with domestic small and medium-sized enterprises at the 'Korea Electronics Show (KES 2022)' held at COEX from the 4th to the 7th.

This booth was jointly attended by Daesung Metal Co., Ltd., Iruda Co., Ltd., SN Co., Ltd., Conan Technology Co., Ltd., KOES Co., Ltd., Terraon Co., Ltd., and RF Materials Co., Ltd., which have conducted collaborative R&D with KETI through the Ministry of SMEs and Startups' 'Leading Research Institute Collaborative Technology Development Project' and 'Small and Medium Business Strategic Collaborative Technology Development Project'.

The seven companies participating in the 'KETI Industry-Research Cooperation Hall' exhibited numerous products and technologies developed through collaborative R&D with KETI, and conducted business consultations to promote technology commercialization.

Daesung Metal Co., Ltd. showcased a conductive heat-dissipating ink material for bonding electric and electronic components using copper-graphene particles, while Iruda Co., Ltd., a company specializing in aesthetic medical devices, showcased an image processing technology that recognizes skin lesions through camera images, and SN exhibited a wireless communication control system based on LORA (Long Range)..

In addition, Conan Technology Co., Ltd. unveiled video image understanding, voice recognition/speech synthesis AI solution, and neural search engine technology, Koes Co., Ltd. presented a building-integrated photovoltaic (BIPV) system, Terraon Co., Ltd. presented Die Attach Paste (TERABOND), a low-temperature pressureless sintering adhesive for power semiconductor packages, and a high-efficiency proximity radiant heater module for EV indoor heating based on nanocarbon, and RF Materials Co., Ltd. presented RF power transistors and packages (PKG) for optical communications.

KETI plans to continue to support the growth of small and medium-sized enterprises throughout their entire lifecycle, including by discovering needs for R&D cooperation and providing planning, business diagnosis, business management, market development, and intellectual property consulting in cooperation with the Technology Information Promotion Agency (TIPA).

KETI President Shin Hee-dong said, “The ultimate goal of R&D by SMEs is technology commercialization, and to achieve this, it is important to have the insight to discover the technologies companies need and a full-cycle cooperative system that can provide timely support according to market demand.” He added, “KETI will spare no effort in its role as a growth platform that can help SMEs take their technological innovation capabilities to the next level.”
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