STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is introducing new STM32MP2 series 64-bit microprocessors, achieving SESIP Level 3 certification and providing interfaces to support industrial applications and dedicated edge AI acceleration.

STMicroelectronics today announced the launch of the second-generation STM32 microprocessors (MPUs) that boost performance and security for industrial and IoT edge applications with a new architecture based on the same ecosystem.

“Stacking further its investment in application processors, we are introducing new STM32MP2 series devices that combine a 64-bit core with edge AI acceleration, advanced multimedia, graphics processing, and digital connectivity,” said Ricardo De Sa Earp, Executive Vice President, General Manager, General-Purpose Microcontroller Subgroup, STMicroelectronics. “By also integrating advanced security features into the hardware, these new MPUs open new possibilities for secure Industry 4.0, IoT, and rich user-interface applications.”

The first product line of the new generation, the STM32MP25, features single or dual 64-bit Arm® Cortex®-A35 cores running efficiently at 1.5GHz. It also features a 400MHz Cortex-M33 embedded core that handles real-time processing.

A dedicated Neural Processing Unit (NPU) with up to 1.35 TOPS (Tera-Operations per Second) of compute performance is optimized for edge AI acceleration in applications such as advanced machine vision and predictive maintenance.

Additionally, the STM32MP25 ensures long-term support for cost-optimized designs with 32-bit DDR4 and LPDDR4 memories.

In addition, the STM32MP25 product line includes support for Gigabit Time-Sensitive Networking (TSN), a 2-port Gigabit Ethernet TSN switch, and PCIe, USB 3.0, and CAN-FD peripherals to address the advanced connectivity functions required for real-time industrial applications, data concentrators, gateways, and telecom equipment.

The combination of these processing and networking capabilities enhances sensing and feature recognition capabilities in security and industrial automation applications.

As an example, this MPU captures video from a 5-megapixel sensor at 30 frames per second (fps), performs analytics with an edge AI accelerator, and then transmits the sensing metadata and associated video (encoded with a HW encoder) all in real-time streaming mode using Gigabit Ethernet TSN.

A 3D GPU (Graphics Processing Unit) with 1080p resolution for graphics and video capabilities enables rich user interfaces along with Vulkan real-time graphics support for Android applications.

Multiple display connections including LVDS, 4-lane MIPI DSI, MIPI CSI-2 camera interfaces and 1080p encoder/decoder are available as original- Simplifies connectivity to digital cameras and displays, including raw-Bayer image sensors.

State-of-the-art security features that ensure SESIP Level 3 certification include Arm’s TrustZone® architecture and the Resource Isolation Framework (RIF).

Additionally, it supports secure key storage, secure boot, unique device ID based on One-Time Programmable (OTP) memory, hardware encryption engine, and on-the-fly DDR encryption/decryption.

These devices are specified over an extended temperature range of -40°C to 125°C, easing thermal management and adding reliability in industrial environments. In addition, like other STM32 MPUs targeting industrial applications, STM32MP2 series MPUs are backed by ST’s 10-year longevity commitment program.

The package is available in a variety of options, including a 0.8mm pitch chip-scale package (TFBGA), which allows for easier PCB design routing and allows for economical designs up to four layers without the use of expensive laser vias.

Developers using these new devices can leverage the extensive STM32MPU ecosystem, which includes the popular OpenSTLinux distribution with a complete AI framework (X-Linux-AI) in addition to the STM32Cube development tools. The STM32Cube firmware runs bare metal or an RTOS on the Cortex-M33 embedded core.

ST is currently sampling STM32MP25 devices together with evaluation boards to selected OEM customers. Volume production of chips and boards is scheduled to begin in the first half of 2024. ST unveiled its new STM32MP2 MPU product at the 'STM32 Summit' event held in Shenzhen, China from May 12th to 13th.

For more information, please visit https://www.st.com/stm32mp25.