The global semiconductor packaging materials market is expected to grow at a CAGR of 2.7% to reach approximately USD 30 billion by 2027, driven by increasing demand for advanced packaging solutions.

SEMI, an industry association representing the global electronics industry supply chain, forecasted that the global semiconductor packaging materials market will grow at a CAGR of 2.7% from $26.1 billion in 2022 to $29.8 billion in 2027 due to technological innovation and increasing demand for advanced electronic products.

This outlook is based on the Global Semiconductor Packaging Materials Outlook report jointly produced by SEMI, TECHCET and TechSearch.

This growth is expected to be driven by increasing demand for advanced packaging solutions driven by the adoption of high-performance applications, 5G, artificial intelligence (AI), heterogeneous integration, and system-in-package technologies.

“The semiconductor packaging materials industry is undergoing significant change as new technologies and applications drive increased demand for a wider range of materials,” said Jan Baderman, CEO of TechSearch. “Advances in dielectric materials and underfill materials are driving the demand for fan-in and fan-out wafer-level packaging, flip-chip, and 2.5D/3D packaging. New substrate technologies such as silicon interposers and organic interposers using RDL (Re-Distribution Layer) are also emerging as major growth drivers for packaging solutions. In addition, research on glass core substrates and laminate substrates with finer properties is also ongoing,” he said.

The Global Semiconductor Packaging Materials Outlook (GSPMO) report cited in this announcement provides a comprehensive analysis of the current and projected semiconductor packaging materials, including substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer-level package dielectrics, and wafer-level plating chemicals.

Meanwhile, e4ds will host the ' 2023 e4ds Semiconductor Packaging Day ' event at the Korea Conference Center Main Hall on June 28. At this seminar, top domestic and international packaging experts, including Intel, Nepes, Applied Materials, Hanyang University, and Hyundai Motor Securities, will present on next-generation packaging solutions. Participation in the event can be done on the ' 2023 e4ds Semiconductor Packaging Day ' ( https://www.e4ds.com/seminar_introduce.asp?idx=137 ) website.