Advantages such as high power density, compact design, and simplified assembly
Available in 4-pack, 6-pack, and Totem Pole configurations… Flexible configuration options available

STMicroelectronics (hereinafter ST) has introduced a family of SiC power modules to the market that supports automotive applications and features cutting-edge 2nd and 3rd generation SiC MOSFET technology.

ST announced on the 31st that it has launched the ACEPACK (Adaptable Compact Easier PACKage) DMT-32, a family of SiC power modules based on a 32-pin Dual-Inline Molded Through-Hole package.

This product family targets systems such as on-board chargers (OBCs), DC/DC converters, fluid pumps, and air conditioners, offering benefits such as high power density, a compact design, and simplified assembly.

In addition, it is available in 4-pack, 6-pack, and Totem-Pole configurations, allowing system designers to flexibly select the necessary configuration.

This module is equipped with a 1,200V SiC power switch utilizing ST's state-of-the-art 2nd and 3rd generation SiC MOSFET technology that ensures a low RDS(on) value.

This device provides an efficient switch while minimizing the effects of temperature.It provides high performance, ensuring high efficiency and reliability at the converter system level.

Featuring ST's robust ACEPACK technology, this module reduces overall system and design development costs while providing exceptional reliability.

This package technology uses a high-performance aluminum nitride (ALN) insulating substrate for excellent thermal performance.

It is also equipped with an integrated NTC sensor that provides temperature monitoring to prevent overheating.

The first product of ACEPACK DMT-32 is M1F45M12W2-1LA, and mass production will begin in the fourth quarter of 2023.