HBM4 to be launched in 2026… “HBM on GPU”
Published2023.11.30 16:53HBM (High Bandwidth Memory), which has emerged to revolutionize processing speed, is a high-bandwidth memory that vertically connects multiple DRAM chips using TSV (Through Silicon Via) technology. The HBM market is dominated by Samsung Electronics and SK Hynix, with Micron following behind. According to TrendForce, last year's global HBM market share was SK Hynix at 50%, Samsung Electronics at 40%, and Micron at 10%. HBM4, which will be released in 2026 to meet demand from cloud service providers (CSPs) such as NVIDIA, Amazon, Google, and Microsoft, will introduce methods different from current semiconductors.
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[Planning-Chat GPT3③] AI Semiconductor and Data Center Market ‘Active’
Investment in key AI market infrastructure, including domestic and international AI semiconductors and data centers, is being accelerated. Samsung Electronics has been continuously advancing 'HBM-PIM,' which combines memory semiconductors and AI processors into one unit, since 2021. SK Hynix has succeeded in developing 'HBM3,' a next-generation stacked memory optimized for AI inference and learning performance. Data centers provide cloud computing services capable of collecting, storing, and analyzing big data, and are well-suited for training AI models. Domestically, investment in data centers for securing stable infrastructure is accelerating alongside AI semiconductor development.
2023.03.06by 김예지 기자
SK Hynix Develops Highest Capacity 24GB 12-Layer Stacked HBM3
SK하이닉스가 현존 최고 성능 및 최고 용량인 24GB 12단 적층 D램인 ‘HBM3’를 개발하며, 최첨단 D램 시장 주도권 강화에 나섰다.
2023.04.20by 배종인 기자
Intel Xeon, HBM combination solves massive data processing
The volume of data demanded by devices such as automobiles that function with artificial intelligence technology and software is rapidly increasing. As market demand rises for technologies that can respond to growing data volumes and effectively leverage such data, memory speed that supports processors has become essential not only to satisfy data processing speed but also to meet the capacity of data that can be processed.
2023.06.12by 명세환 기자
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SK Hynix, deficit ↓ with HBM3 and DDR5, recovery expected in the second half
2분기 메모리 반도체 실적은 모바일, PC 등 소비자향 제품 및 일반 서버의 저조한 수요 회복으로 연이은 적자를 기록했다. 다만 AI 서버 시장의 활황으로 HBM3와 DDR5 등 고부가가치 라인업에서 수주 확대가 이뤄져 점진적 회복이 전망되고 있다.
2023.07.26by 명세환 기자
The AI Accelerator War: HBM3 to Rise Rapidly in 2024
Market research firm TrendForce stated on the 1st that new HBM3 and HBM3e will become mainstream in the market in 2024, citing increasing demand for AI accelerator chips and a trend of companies developing their own chips. To avoid Nvidia's growing influence, the industry has recently been focusing on developing its own AI chips. As demand for AI accelerator chips evolves, growth in HBM3 and HBM3e is expected.
2023.08.03by 김예지 기자
