EV Group (EVG) has stepped up its efforts to target the Korean semiconductor equipment market by showcasing its advanced memory and packaging process solution technology.

EVG will participate in 'Semicon Korea 2026,' held at COEX in Seoul from February 11 to 13, and showcase core process technologies for advanced memory semiconductors and next-generation packaging.

At this exhibition, EVG plans to unveil the latest solutions to accelerate heterogeneous and 3D integration, such as hybrid and fusion bonding, thin film separation, and maskless lithography.

EVG introduces the GEMINI® FB wafer bonding system for mass production and the EVG®40 D2W die-to-wafer overlay metrology system, focusing on wafer bonding technology that supports the mass production of advanced memory such as high bandwidth memory (HBM), 3D NAND, and DRAM.

In particular, the hybrid bonding process, which achieves submicron-level alignment accuracy, is attracting attention as a key technology for high-yield 3D integration and the implementation of chiplet-based systems.

Maskless lithography technology for advanced packaging and fine-pitch wafer probe card manufacturing is also a major exhibit.

EVG's LITHOSCALE® XT system provides up to 5x throughput improvement over conventional systems, enabling fan-out wafer-level packaging (FOWLP) and AI·Implements a digital lithography environment suitable for mass production of semiconductors for HPC.

The ability to flexibly respond to design changes is also a strength.

In addition, IR LayerRelease™ thin film separation technology enables silicon carrier-based ultra-thin die stacks, presenting a new alternative for 3D-ICs and next-generation packaging processes.

This technology utilizing infrared lasers is attracting attention for its high precision and throughput.

EVG plans to participate in the Semicon Korea Technology Symposium during the exhibition to share the latest trends in maskless lithography and thin film separation technology.

If you visit the EVG booth (DS26) during the exhibition, you can experience firsthand EVG’s innovative solutions leading hybrid bonding, maskless lithography, and ultra-thin film separation technologies, and also have the opportunity to consult with EVG representatives.