A venue for academic exchange was established to discuss the future direction of packaging material technology, which is emerging as a core technology in the advanced semiconductor industry. The Korea Institute of Materials Science announced that it held a forum involving experts to share trends in semiconductor packaging material technology and strengthen the foundation for industrial cooperation.

The Korea Institute of Materials Science and Engineering (KIMS) held the "1st Advanced Semiconductor Technology and Packaging Materials Innovation Forum" on March 13 at the main auditorium of its headquarters in Changwon, Gyeongnam, to discuss the future direction of advanced semiconductor packaging technology and related materials industries. The event was organized to share the current status of research and development in the field of advanced packaging, which is attracting attention as a key technology to complement the limitations of semiconductor microfabrication, and to explore cooperative frameworks.

At the event, experts from industry, academia, research institutes, and government participated in presentations and discussions centered on key issues in the semiconductor technology and materials industries. The first session covered key topics such as the development of semiconductor technology for future mobility, the characteristics of SiC power semiconductor materials, the direction of the semiconductor materials, parts, and equipment specialized complex, an advanced packaging testbed platform, and a heterogeneous integration platform for next-generation AI accelerators.

In the subsequent second session, composite semiconductor technology for smart heterogeneous integrated systems, advanced packaging wiring material technology, and research cases regarding thermal management and reliability assurance in semiconductor packaging were introduced. Following the presentations, an expert panel discussion was held on the topic of advancements in semiconductor packaging material technology, during which opinions were presented regarding directions for technological development and collaboration strategies.

Choi Chul-jin, President of the Korea Institute of Materials Science (KIMS), stated that the institute intends to strengthen its role in securing semiconductor packaging material technology as a specialized research institution in the field of materials. He expressed his hope that the forum would share an understanding of advanced packaging material technology and contribute to the formation of a cooperative network among industry, academia, and the government.