Samsung Electronics and AMD are significantly expanding the scope of their cooperation to strengthen the competitiveness of next-generation artificial intelligence (AI) infrastructure. The two companies plan to strengthen their strategic partnership centered on AI memory and computing technologies and accelerate their penetration of the next-generation data center market.

Samsung Electronics announced on the 18th that it signed a memorandum of understanding (MOU) with AMD at its Pyeongtaek plant for cooperation on next-generation AI memory and computing technologies.

Key executives from both companies, including Jeon Young-hyun, Head of Samsung Electronics’ DS Division, and Lisa Su, CEO of AMD, attended the signing ceremony.

Through this agreement, Samsung Electronics has been selected as the preferred supplier of high bandwidth memory (HBM4) for AMD's next-generation AI accelerators.

Accordingly, Samsung Electronics plans to supply industry-leading performance HBM4 to AMD's next-generation AI accelerator 'Instinct MI455X' GPU.

This product is considered a solution optimized for data center environments that perform large-scale AI model training and inference.

Samsung Electronics began mass production of HBM4 using 1c DRAM and 4nm base die technology last February, thereby simultaneously increasing data processing speed and power efficiency.

The strategy is to further solidify leadership in the next-generation AI memory market through this supply to AMD.

The two companies are also expanding cooperation in the server and data center platform sectors.

Samsung Electronics plans to support overall system performance improvement by supplying high-performance DDR5 memory solutions to AMD's 6th generation EPYC server CPUs and rack-based data center platform 'Helios'.

Along with this, the possibility of cooperation in next-generation semiconductor foundry manufacturing is also being discussed.

Samsung Electronics plans to support AMD's AI roadmap in various ways based on its integrated turnkey capabilities encompassing memory, foundry, and advanced packaging. />
Jeon Young-hyun, Head of the DS Division, stated, “Samsung and AMD share a common vision for the advancement of AI computing,” adding, “We will support AMD’s future AI platform competitiveness by combining next-generation memory and manufacturing technologies.”

CEO Lisa Su also stated, “The combination of Samsung’s memory technology and AMD’s GPU, CPU, and platform capabilities will create significant synergy in realizing next-generation AI infrastructure.”

Meanwhile, Samsung Electronics and AMD have maintained a cooperative relationship in the graphics and computing fields for over 20 years, and Samsung Electronics has also served as a key supplier of HBM3E, which is used in AMD's latest AI accelerators. Through this agreement, both companies are expected to further strengthen cooperation across the entire AI ecosystem.