As power demand surges due to the proliferation of AI and electric vehicles, the technology to reliably supply more power in limited spaces is emerging as a key challenge across industries. In response to this demand, Texas Instruments (TI) has unveiled high-performance isolated power modules featuring proprietary packaging technology, presenting a new direction for power design.

TI introduced a next-generation isolated power module targeting data centers and electric vehicles during an online press conference on the 24th.

Park Su-min, FAE at TI Korea who gave the presentation, emphasized, “Power density is no longer just a simple performance indicator, but a key factor determining system competitiveness,” adding, “We have entered an era where efficiency, heat generation, EMI, and reliability must be satisfied simultaneously in smaller spaces.”

The newly unveiled UCC34141-Q1 and UCC33420 power modules feature TI's proprietary IsoShield™ multi-chip packaging technology.

This technology integrates a high-performance planar transformer and an isolated power stage into a single package, achieving up to three times higher performance compared to conventional discrete component-based designs.It implements power density.

At the same time, the solution size can be reduced by up to 70%, significantly reducing PCB area, weight, and the number of components.

Park Su-min, an FAE, explained, “Existing isolated power supply designs required controller ICs, transformers, and numerous passive components, resulting in high design complexity and a high probability of errors. IsoShield technology integrates these elements into a single SiP, reducing single points of failure and ensuring both safety and reliability.”

Another feature is that it supports everything from functional insulation to basic and reinforced insulation.

These power density innovations are particularly significant for data centers and electric vehicles.

With the proliferation of AI and cloud computing, data centers must integrate more computational performance into the same rack space, and power supply and thermal management are acting as bottlenecks.

TI's isolated power modules support the implementation of next-generation data center architectures by providing high power density in server and rack power designs while maintaining efficiency and safety.

The effect is also clear in the electric vehicle sector.

In situations where vehicle interior space is limited, the miniaturization and weight reduction of power converters are directly related to driving range.

Power modules equipped with IsoShield technology can be applied to various areas, such as OBCs, DC-DC converters, and gate driver bias power supplies, and meet the temperature and reliability standards required in automotive environments while reducing size and weight.

TI has built a portfolio of over 350 power modules, including this technology, and is simultaneously aiming to reduce design time and costs through packaging innovations such as MagPack™ and IsoShield™.

Park Su-min FAE is &ldqu“As the level of integration of power modules increases, the design burden on engineers decreases, and system performance can be improved more quickly,” he said.