▲ Dr. Kim Hyung-woo's research team at KIMM

AI diagnoses semiconductor process status

The Korea Institute of Machinery and Materials (KIMM) has unveiled a plasma-based integrated process technology in which artificial intelligence (AI) autonomously analyzes and controls next-generation 2D semiconductors that are extremely thin at the atomic layer level. This is significant as it is a method that diagnoses and responds to process conditions without human intervention, especially as the need for precise process control at the atomic layer level grows as semiconductor devices become miniaturized.

A research team led by Senior Researcher Kim Hyung-woo of the Semiconductor Equipment Research Center at the Korea Institute of Machinery and Materials announced on the 17th that they have developed an intelligent system in which AI autonomously analyzes and controls 2D semiconductor processes based on process diagnosis results.

The research team explained that they implemented an integrated plasma-based process by incorporating AI to interpret process data in real time and adjust conditions.

2D semiconductors are thin, with a thickness of only one atomic layer, so their properties change significantly even with minute variations during the manufacturing process.

Accordingly, the research team integrated the plasma process and diagnostic process into a single unit and combined it with AI analysis and control functions. It is a structure in which AI interprets diagnostic data generated during the process to determine the status and adjusts process variables based on the result.

The research team stated that the system allows AI to autonomously perform analysis and control based on process diagnostic results.

It is reported that this will enable a reduction in human intervention in next-generation semiconductor processes requiring precise control at the atomic layer level.

Technical inquiries can be made through Senior Researcher Hyung-Woo Kim of the Semiconductor Equipment Research Center at the Korea Institute of Machinery and Materials.