May 20, 2015 – ON Semiconductor (NASDAQ: ON; www.onsemi.com), driving energy efficiency innovations, has introduced its latest high-performance 80-amp Power Integrated Module (PIM) for wireless power supplies (UPS), industrial variable frequency drives (VFDs), and solar inverter applications.

The NXH80t120L2Q0PG PIM module, which incorporates ON Semiconductor's proprietary Trench Field Stop II technology along with powerful ultra-fast fast recovery diodes, achieves greater than 98% efficiency in 1200 volt, 80 amp half-bridge and 600 volt, 50 amp neutral clamp T-type topologies.

The configurable package platform utilizes high-power direct-bonded-copper circuit board technology with patented press-fit pins to provide customers with high-efficiency, high-reliability power module solutions.

ON Semiconductor has entered the PIM market, leveraging over 30 years of experience developing automotive ignition IGBTs and Intelligent Power Modules (IPMs). The NXH80T120L2Q0PG PIM leverages ON Semiconductor's extensive packaging expertise and fully meets the demanding industry standards of maintaining a junction temperature of 175°C. ON Semiconductor's module solutions are delivered to customers at reasonable prices while ensuring high quality through a supply chain that fully covers not only silicon but also packaging.

“Power integrated modules are an essential part of our ‘Power Vision’ as we plan to expand into higher power industrial and automotive markets,” said Paul Leonard, vice president and general manager of power device products at ON Semiconductor. “With this new robust power module platform, we are able to provide our customers with a portfolio of power device and module solutions that fully meets their needs for high-efficiency, high-density power solutions.”

Purchase Information

The NXH80T120L2Q0PG comes in a Q0PACK package (65.9 mm x 32.5 mm x 11.75 mm).

Pricing starts at $30.00 per piece for quantities of 1,000.