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Samsung Electronics and Broadcom Sign $200 Billion MOU Over 5 Years

Google 우선 소스Published2026.07.26 13:00
Collaboration Across All Areas of HBM, 2nm Foundry, and Advanced Packaging… Strengthening the AI Semiconductor Supply Chain
Samsung Electronics and Broadcom are pursuing cooperation worth more than $200 billion by 2030 amidst a surge in demand for custom semiconductors driven by the expansion of the AI accelerator market.

Samsung Electronics announced that it signed an MOU with Broadcom at the 'AI Summit' held at The Midway in San Francisco, USA, on the 24th (local time).

The event was attended by executives from both companies, including Samsung Electronics Foundry Business President Han Jin-man and Broadcom CEO Hock Tan, as well as government officials.

In the memory sector, Samsung Electronics supplies advanced memory solutions, including HBM, to Broadcom's next-generation AI accelerator (ASIC).

Samsung Electronics explained that it began mass production shipments of HBM4 using 1c DRAM and 4nm base die technology in February of this year, and provided HBM4E samples to customers first in May.

HBM4 and HBM4E are expected to be utilized as key components supporting the performance enhancement of Broadcom's AI accelerators.

In the foundry sector, it supports mass production by applying processes of 2nm or smaller to major product lines, such as Broadcom’s semiconductors for high-speed data communication.

The plan is to incorporate advanced packaging technology based on a 2nm process to improve both power efficiency and performance.

Samsung Electronics will contribute to shortening product development time by providing the entire process from the design optimization stage to chip manufacturing, packaging, and mass production. He stated that it is possible.

Jeon Young-hyun, Head of Samsung Electronics’ DS Division, stated, “In the AI era, semiconductor solutions that tightly integrate memory, logic, and advanced packaging are crucial,” adding, “We will expand our cooperation with Broadcom to accelerate the development of future AI infrastructure and provide greater value to our customers.”

Charlie Kawas, President of Broadcom’s Semiconductor Solutions Group, stated, “As AI infrastructure expands rapidly, close cooperation across the entire semiconductor ecosystem is becoming increasingly important,” adding, “We will work with Samsung Electronics to create next-generation solutions optimized for market demands.”
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