Congatec Acquires OT·IT Security Communication Patent…Strengthening aReady.COM Functionality
Published2026.08.26 10:00
aReady.COM is an embedded hardware and software solution that integrates IoT connectivity, security, virtualization, and AI on a single platform, designed with a structure that can be immediately applied to applications, the company stated.
The security barrier between the two virtual machines blocks direct data transfer between IT and OT domains, and the 'data projection' method prevents unauthorized access to OT devices or IT infrastructure from external sources.
Through this, Congatec explained that machines, applications, and communication functions can be integrated into a platform with built-in security from the design stage.
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Congatec Establishes Asian Embedded R&D Hub in Penang
Congatec has established an Asia-Pacific (APAC) research and development (R&D) center in Penang, Malaysia, and strengthened its local development and technical support system for serving customers in the Asia region. The center integrates engineering personnel from Kontron Asia's embedded design organization and is responsible for developing 'aReady.' based embedded computing platforms and providing customized technical support. This is part of the global strategy of "Local for Local" approach, aimed at shortening development cycles and improving collaboration efficiency in the APAC region where embedded and edge computing demand is expanding. The Penang R&D center conducts computer-on-module (COM) development utilizing x86-based solutions and various semiconductor technologies, and validates and supports field application technologies such as embedded vision, IoT, and system integration within the region. Local institutions view this investment as having leveraging effects in strengthening research and development capabilities and talent utilization in Malaysia's electrical and electronics industry.
2026.02.03by 명세환 기자
congatec Expands its Intel Core Series 2-Based COM-HPC Modules
As real-time control and parallel data processing demands grow in industrial environments, the role of high-performance edge computing modules is expanding. Congatec has broadened its COM-HPC client module product line based on Intel Core Ultra Series 2 to align with this trend. The new products, featuring up to 12 P-cores, up to 192GB ECC memory, and 42 PCIe lanes, target high-compute applications such as test and measurement, medical imaging, robotics, and industrial process automation. Software, virtualization, and IIoT integration options are also provided to address integrated design requirements based on a single module platform.
2026.03.11by 명세환 기자
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Congatec Extends Performance of AMD Ryzen AI-Based COM Modules… Expanding Edge AI Design Flexibility
Congatec has enhanced the performance and scalability of the 'conga-TCRP1', a COM Express module based on AMD Ryzen AI Embedded P100 series. The module integrates up to 12-core CPU, RDNA 3.5 GPU, and XDNA2 NPU to increase edge AI workload processing capability, and offers various core configurations and TDP ranges to expand design flexibility for embedded systems. The module is designed to support real-time data processing and AI functionality required in industrial automation, medical equipment, and smart city infrastructure. A key characteristic is that various performance configurations can be implemented based on a single module, enabling improved design efficiency and system integration during product development.
2026.03.17by 명세환 기자
Congatec Expands Arm-Based 'aReady.COM'... Lowers Development Burden with Pre-Integrated SMARC Modules
Congatec has strengthened its pre-integrated software strategy in the Arm-based computer-on-module (COM) market. In March, the company introduced the 'conga-SMX95,' a SMARC module featuring NXP Semiconductors' i.MX 95 application processor as an expansion product of its Arm-based aReady.COM lineup. This module is designed with pre-configured operating system, bootloader, system integration environment, and IoT connectivity features to reduce the time OEMs spend on initial development and validation. As Arm-based designs gain attention for their performance and power efficiency advantages, this move can be interpreted as an effort to package and mitigate software integration and certification challenges that had been burdensome during actual deployment.
2026.03.19by 배종인 기자
Congatec Expands Intel Core Ultra 3-Based Industrial COM… Enhances Response to Extreme Temperatures
Congatec has expanded its product lineup of industrial Computer-on-Module (COM) based on Intel Core Ultra Series 3 with an extended temperature range version. The new product family is designed to withstand temperatures from minus 40 degrees to plus 85 degrees Celsius, targeting harsh field environments such as vehicles, railways, road infrastructure, and energy facilities. The company has presented AI computing performance along with various form factors, operating systems, and virtualization and IoT software options, indicating its direction to address both new designs and existing industrial system upgrade requirements.
2026.04.08by 명세환 기자
