TI Unveils Multi-Axis Coreless Current Sensor TMCS2100-Q1 for HEV/EV Traction Inverters

This page was machine-translated and may differ from the original. View original

TI Unveils Multi-Axis Coreless Current Sensor TMCS2100-Q1 for HEV/EV Traction Inverters

Published2026.08.27 10:05

Up to 20 Times Higher Accuracy Than Single-Axis · Supports Busbar-Unmodified Design

A Hall-effect current sensor has emerged that overcomes the accuracy limitations of conventional coreless methods by simultaneously measuring horizontal and vertical magnetic fields. Texas Instruments stated that through the TMCS2100-Q1, by combining multi-axis sensing architecture and algorithms, it is possible to simultaneously meet accuracy and miniaturization requirements in traction inverter design.

On the 27th, TI unveiled the TMCS2100-Q1, a multi-axis coreless Hall-effect current sensor for hybrid electric vehicle (HEV) and electric vehicle (EV) traction inverters.

By applying a method that simultaneously measures magnetic fields in horizontal and vertical directions, the company explained that it achieves up to 20 times higher accuracy compared to conventional single-axis coreless sensors.

Displacement error is less than 1% based on 0.4mm displacement and approximately 0.25% based on 0.1mm displacement.

Jason Cole, Vice President of Sensing Products at TI, stated, "As the accuracy requirements for traction inverters increase with the proliferation of 800V architectures, engineers now have a new option to overcome the limitations of conventional Hall-effect current sensing."

The TMCS2100-Q1 was developed based on research from TI's advanced research organization, Kilby Labs.

Simultaneous Implementation of Accuracy and Miniaturization

A key challenge in conventional current sensing methods has been the trade-off between accuracy and system size.

The C-core method using magnetic cores offers high accuracy but increases volume and weight, while the coreless method is advantageous for miniaturization but can result in larger measurement errors due to displacement and magnetic crosstalk.

The TMCS2100-Q1 is designed to reduce minor displacement errors between the sensor and conductor caused by vehicle vibration by simultaneously sensing dual-axis magnetic fields.

TI stated that precise current measurement contributes to reducing torque ripple, thereby decreasing acceleration jerking and motor noise, as well as enabling efficient motor control.

Securing Busbar-Unmodified Design Flexibility

Some conventional differential coreless sensors require machining such as notches, slices, or holes in the busbar for precise measurement, which complicated thermal management and mechanical design.

The TMCS2100-Q1 allows sensor placement without modifying the busbar, thereby increasing mechanical design flexibility and enabling efficient utilization of PCB space, according to the company.

Through this, miniaturization of the entire traction inverter and implementation of high power density are possible.

The TMCS2100-Q1 is currently available for purchase on TI.com, and development support resources including the TMCS2100 evaluation module, characterization evaluation module, and TIDM-2,014 reference design are also provided.

#EV #전력반도체 #모터제어 #TMCS2100-Q1 #전류센서 #홀효과센서 #트랙션인버터 #HEV #800V아키텍처

본 기사에 대한 정정·반론·추후보도 청구는 보도 청구 안내를, 그간 게재된 보도문은 정정·반론보도 모아보기를 참고해 주세요.

배종인 기자

All articles by this reporter

관련뉴스

TI Innovates Data Center and EV Design Paradigm with Next-Generation Isolated Power Modules

With power demand surging due to AI and electric vehicle proliferation, reliable power supply technology in limited spaces has emerged as a critical industry-wide challenge. Texas Instruments (TI) has unveiled the UCC34141-Q1 and UCC33420 high-performance isolated power modules, which employ proprietary packaging technology to address these requirements and establish a new direction for power design.

2026.03.24by 배종인 기자

Practical Training in Low-Noise, Low-Power Circuit Design All in One Place… Training Fee Support

The "2026 Advanced Engineer Practical Masterclass" to strengthen competencies in high-sensitivity analog circuit and sensor-based system design will be held on April 16 at the e4ds Conference Center in Gasan-dong, Seoul. This program will be conducted as an offline paid hands-on training session, not online, and is targeted at engineers seeking on-site intensive learning. Texas Instruments will provide educational support for this training, allowing participation at 150,000 won, a 100,000 won discount from the original price of 250,000 won.

2026.03.26by 배종인 기자

Pradeep Shenoy, TI’s Lead Computing Power Technology, “‘800V, GaN, and SST’ Enable Power Infrastructure for the 1MW Per Rack Era”

Data center power demand is surging due to the widespread adoption of AI, and the existing 48V architecture has reached its limits, requiring a transition to an 800V DC-based structure. The shift to 800V DC requires a redesign of the entire power system, including PSUs, IBCs, and BBUs. Wide bandgap-based technologies such as GaN and SST are emerging as key enablers for achieving high efficiency, high density, and high reliability. Particularly in the 1MW-per-rack era, power, cooling, and safety requirements are increasing sharply, and there is discussion that an approach viewing and designing the entire system as a single power chain will be necessary. To this end, we arranged a meeting with Pradeep Shenoy, Head of Computing Power Technology at Texas Instruments (TI), an expert in data center power products, to discuss product development and related solutions for data center power.

2026.05.29by 배종인 기자

TI Unveils EIS-Integrated 26-Cell Battery Monitor… Enhanced BMS Diagnostic Capabilities

Texas Instruments (TI) has unveiled a 26-cell battery monitor with an integrated EIS engine. The new product focuses on real-time analysis of battery cell conditions in electric vehicles and energy storage systems (ESS), as well as early detection of internal anomalies. TI plans to reduce BMS design complexity and support battery safety and longevity management through this product.

2026.06.10by 배종인 기자

From ADAS to Fully Autonomous Driving, 'Semiconductors' at the Center of Advanced Technology

According to Texas Instruments' video materials featuring Mike Pienovi, president of TI's High-Performance Processors division, and Sneha Narnakaje, TI's automotive radar sensor business manager, who recently test-drove vehicles equipped with ADAS functions, approximately 1,000 to 3,500 semiconductors are installed in a single vehicle today, and their importance continues to grow as the level of autonomous driving increases.

2026.07.07by 배종인 기자