Establishing First U.S. HBM Production Base with Over $4 Billion Investment

Pursuing Joint Research on Next-Generation Packaging Technology with Purdue University

SK Hynix is establishing its first high bandwidth memory (HBM) production base in the United States, expanding its AI semiconductor supply chain. The company plans to strengthen its response capability in the AI memory market by building production and research and development (R&D) infrastructure within the U.S.

SK Hynix announced on the 27th (local time) that it held a groundbreaking ceremony for an advanced packaging production facility for AI memory in West Lafayette, Indiana, U.S.

The project will be invested with over $4 billion. The production facility aims to complete the cleanroom by October 2028, and is scheduled to begin mass production of next-generation HBM from the second half of 2029.

The Indiana production base is SK Hynix's first HBM production base in the United States. Using wafers produced in Korea, the company will perform advanced packaging and testing processes locally in the U.S., thereby producing 'Made in USA' HBM products.

SK Hynix plans to build an advanced packaging R&D testbed alongside the production facility.

Through this, the company plans to support customers, universities, and partners in jointly researching next-generation packaging technologies and performing prototype manufacturing and performance verification.

The company expects this investment to contribute to stabilizing the U.S. semiconductor supply chain and strengthening competitiveness in the AI industry.

Additionally, over 100 materials, components, and equipment partners are reviewing local expansion, and the company projected that approximately 7,000 direct and indirect jobs will be created during factory construction and operation.

SK Hynix also signed a Memorandum of Understanding (MOU) with Purdue University at the groundbreaking ceremony for research and development cooperation.

The two parties plan to pursue joint research in the fields of HBM and next-generation system integration, and advanced packaging technology. Additionally, they are reviewing expansion of cooperation with major universities and research institutions in the U.S. Midwest.

Furthermore, SK Group announced plans to participate in a recruitment program targeting U.S. Forces Korea (USFK) service members and their families, expanding the foundation for economic and industrial cooperation between the two countries.

Kwak No-jung, President and CEO of SK Hynix, stated, "The Indiana production base will become the first HBM supply point produced in the United States," and expressed the company's commitment to continue expanding investments and cooperation within the U.S.