Applied Materials and KIOXIA to Co-develop Next-Generation Memory at EPIC Center

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Applied Materials and KIOXIA to Co-develop Next-Generation Memory at EPIC Center

Published2026.09.30 08:54

Joint research on advanced cell structures, chip stacking, and packaging technologies to enhance memory density and performance for AI applications

Applied Materials and KIOXIA have established a formal cooperation framework aimed at advancing memory technology in the AI era. With KIOXIA, a global flash memory company, joining the Silicon Valley EPIC (Equipment and Process Innovation and Commercialization) Center as an innovation partner, the two companies are jointly pursuing research and development (R&D) across all areas from advanced memory cell and structure formation through multichip stacking, advanced packaging, and materials engineering innovation.

Applied Materials announced on the 30th that it has selected KIOXIA as an innovation partner for the EPIC Center.

The EPIC Center is a facility established through approximately $5 billion in R&D investment, representing the largest-scale investment in advanced semiconductor equipment in U.S. history.

Preparations are underway to commence operations within the year, and the company explained that it is designed to shorten the technology commercialization period from initial research stages through large-scale mass production.

Gary Dickerson, Chairman and CEO of Applied Materials, stated, "AI infrastructure requires memory solutions that deliver high density, wide bandwidth, and improved energy efficiency. By combining KIOXIA's memory technology expertise with Applied's materials engineering capabilities, we will redefine the possibilities of next-generation memory."

Ota Hiroo, President and CEO of KIOXIA, said, "The potential of memory is determined by how far we extend the boundaries of materials and process innovation. We are now able to achieve advanced technology innovation together at the EPIC Center."

The areas where the two companies will collaborate at the EPIC Center are △advanced memory cell and structure formation △multichip stacking architecture △advanced packaging for stacked memory △materials engineering innovation with large-scale manufacturability.

The collaboration focuses on enhancing memory density and performance required for AI applications, with the cooperation scope also including improving integration density and interconnect performance for complex multi-die memory solutions.

Kazimoto Minori, Head of Advanced Memory Development at KIOXIA, stated, "Through collaboration at the EPIC Center, we have established an environment to address challenges in next-generation memory. We aim to accelerate the commercialization of next-generation memory and packaging technologies for AI computing."

Beyond KIOXIA, the EPIC Center comprises a collaborative ecosystem involving chip manufacturers, design companies, equipment partners, and universities.

Applied Materials explained that chip manufacturers can leverage Applied's R&D portfolio early in a secure collaborative environment and, through rapid learning cycles, quickly transition next-generation technologies to mass production.

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