Achieve Complete Verification with the Stronger Mentor PCB Design Validation Tool 'HyperLynx'
Published2016.04.04 12:41관련뉴스
Mentor Unveils Pre-integrated and Comprehensive Platform Supporting Connectivity Between Automotive and Home Appliances
Mentor Graphics announced the launch of the Mentor Automotive Connected OS™ software platform, targeting next-generation automotive applications.
2015.11.02by 신윤오 기자
Mentor Graphics Supplies 'Capital' Electrical System Tools to GM Vehicle Development Project
Mentor Korea (www.mentorkr.com, CEO Yang Young-in) announced that Mentor® Capital®, an electrical systems and wire harness domain design verification solution, will be utilized in General Motors' (GM) vehicle development project as an electrical systems design tool.
2016.02.16by 신윤오 기자
Mentor Graphics Launches Emulation for Comprehensive System Design Verification
On February 22nd, a Mentor Graphics press briefing was held at the Ritz-Carlton Hotel in Yeoksam-dong, Seoul. The session was led by Gabriele Pulini, Product Marketing Manager of Mentor Graphics' Emulation Division (photo). He explained that "the emulation market is growing increasingly larger compared to the simulation market" and conveyed that "Mentor Graphics' recently launched 'Veloce app' can resolve critical verification issues in system design."
2016.02.25by
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
Semiconductor specialist ROHM has developed the 'RESDxVx series' of ESD (electrostatic discharge) protection diodes capable of responding to next-generation high-speed data communication environments exceeding 10Gbps, simultaneously enhancing both signal quality maintenance required in high-speed interfaces and IC protection performance.
2026.03.26by 배종인 기자
