"You can trust SanDisk storage for IoT applications in automotive, industrial, and other sectors"
Published2016.04.04 14:25Related news
SanDisk: The SSD market will move toward high-capacity TLC (Triple Level Cell).
SanDisk held an event on the 27th at Seoul Asia Tower to launch an SSD with a thickness of 1.5mm. On this day, Product Marketing Manager Suhas Nayak began with a presentation on '2016 SSD Trends' and introduced the X400 product.
2016.01.28by
SanDisk, the SSD market will move toward high-capacity TLC (Triple Level Cell)
SanDisk held an event on the 27th at Seoul's Asia Tower to launch a 1.5mm thick SSD. On this day, Product Marketing Manager Suhas Nayak introduced the X400 product, beginning with a presentation on '2016 SSD Trends'.
2016.01.28by 명세환 기자
SanDisk Significantly Upgrades Mobile Flash Drive Capacity
SanDisk, a global leader in flash storage solutions, has further expanded its mobile storage portfolio by upgrading two of its most popular mobile flash drive products. The award-winning SanDisk Connect™ Wireless Stick now offers a capacity of 200GB*, while the SanDisk Ultra® Dual USB Drive 3.0 is available in 128GB. Additionally, with increased transfer speeds, the company has provided consumers seeking to expand the usability of their mobile devices with a wider range of options.
2016.02.18by
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
Semiconductor specialist ROHM has developed the 'RESDxVx series' of ESD (electrostatic discharge) protection diodes capable of responding to next-generation high-speed data communication environments exceeding 10Gbps, simultaneously enhancing both signal quality maintenance required in high-speed interfaces and IC protection performance.
2026.03.26by 배종인 기자
