HybridPACK™ DSC Power Module Launch

Many hybrid and electric vehicles (HEVs) are needed to meet the strengthened global automotive CO2 emission regulations by 2020. The CO2 emission limits are the lowest in Europe at 95 g/km, followed by the US at 121 g/km, China at 117 g/km, and Japan at 105 g/km.

When implementing electric vehicles on existing automotive platforms, space constraints become a major issue; since inverters are typically mounted in the cramped engine compartment, they must be as small as possible. The size of the inverter is primarily determined by the power module used. Therefore, the power module must drive the electric drivetrain with efficient power supply while remaining as compact as possible. However, the size of the power module is determined by the power consumption of the internal power chips and the cooling performance required to maintain the chip temperature below the maximum junction temperature.

To address these challenges, Infineon Technologies (Korea CEO Seung-soo Lee) has launched the HybridPACK™ DSC (Double Sided Cooling), a new family of power modules for hybrid and electric vehicles. The new power modules are available in a very small size of just 42mm x 42.4mm x 4.77mm. Targeting HEV applications such as drive inverters and generators in the typical power range of 40 to 50kW, they can be used in parallel configurations to support higher power.

The power module has a very low stray inductance of only 15 nH, and the cutoff voltage has been increased from the existing 650 V to 700 V. Therefore, by reducing switching losses by approximately 25%, it supports the development of high-efficiency inverter systems. Each module can be attached directly to the cooler without insulation between modules, simplifying system assembly. Each IGBT chip integrated into the module is equipped with an on-chip current sensor for overcurrent protection. Additionally, it features an on-chip temperature sensor, enabling derating or rapid shutdown in the event of module overheating. These features enhance system monitoring capabilities, allowing automotive system suppliers and manufacturers to simplify functional safety architectures.

By combining double-sided chip cooling and electrical insulation of the heat sink, the thermal resistance RthJC of the HybridPACK DSC has been significantly reduced to 0.1 K/W (Kelvin/Watt). In contrast, the current power module HybridPACK 1 has a thermal resistance of 0.12 K/W. HybridPACK DSC module technology also improves electrical performance. Stray inductance is one of the key parameters, determined by the module size and the design of the current path through the module; it is only 15 nH, which is about 40% lower than the reference module (Hybrid PACK 1), reducing switching losses by 25%.