High performance in a small footprint, available in a TO-Leadless package

Infineon Technologies AG (Korea CEO Seung-Soo Lee) has launched CoolMOS™ C7 Gold 650V in a TO-Leadless package.

This new product combines advanced superjunction (SJ) semiconductor processes with advanced SMD package design to deliver superior performance in hard switching applications. The package’s small footprint provides power density advantages for server, telecom, and solar applications.

C7 Gold CoolMOS technology with 4-pin Kelvin source capability and improved thermal characteristics in a TO-Leadless package enables rational SMD solutions for high current topologies such as power factor correction (PFC) up to 3 kW.


Additionally, the improved performance of C7 Gold delivers higher efficiency while reducing switching losses and heat dissipation. C7 Gold technology delivers the industry’s lowest unit area on-resistance Ron*A and a small size of just 115 mm², resulting in the lowest RDS(on) power density achievable in such a small footprint, at 33 mΩ.

The TO-Leadless package offers a 30% reduction in footprint compared to other conventional SMD packages such as the D²PAK, with a 50% and 60% reduction in height and space. The package can also be connected using a standard 3-pin MOSFET or a 4-pin Kelvin source approach. This provides the additional benefit of increasing efficiency, especially at full load, and makes the device easier to use by reducing ringing at the gates.

The high-quality TO-Leadless package has a very low source inductance of 1 nH, is lead-free and is MSL1 compliant. It also provides easy visual solder inspection and is suitable for wave and reflow soldering. Compared to through-hole packages, TO-Leadless has many advantages beyond high power density. The simple mounting process of the SMD package enables cost savings in manufacturing.