Xilinx Expands SDSoC Development Environment to Boost Productivity
Published2016.06.17 15:58Leverage system -level profiling tools and accelerate C/C++ -based programming .
Xilinx announced the 2016.1 release of its SDSoC™ development environment, enabling software-defined programming for its Zynq family of SoCs and multiprocessing (MP) SoCs using the C/C++ language.
This new release also includes support for the recently announced 16nm Zynq UltraScale+™ MPSoC. It also cuts compilation times in half and significantly increases productivity through system-level profiling tools.
“We have seen significant growth in the number of users of this SDSoC development environment, with over 650, many of whom are designing Zynq SoC-based products, significantly reducing time to market,” said Nick Ni, senior manager of SDSoC product marketing and planning at Xilinx. He added, “It also significantly reduces edit time and system-level performance time with Zynq UltraScale+ MPSoC support.”
System and embedded software engineers can easily program Zynq UltraScale+ MPSoC devices using the SDSoC development environment. SDSoC automates the acceleration of C/C++ functions from the ARM application processing unit into the FPGA fabric by generating custom hardware IP using high-level synthesis (HLS), hardware connectivity, software drivers, and application executables with a single click of a button.
Unlike traditional siloed embedded software and hardware development processes, which often result in development delays and uncertain system architecture and performance, SDSoC enables rapid system profiling and architecture exploration within the familiar Eclipse IDE framework. This release also enables real-time, system-level identification of performance bottlenecks using hardware and software event tracing monitors.
관련뉴스
Xilinx Releases Vivado Design Suite HLx Edition with 30% Performance Boost
Xilinx announced the 2016.1 release of the Vivado® Design Suite HLx Edition, which expands SmartConnect technology. This release delivers outstanding levels of performance across the UltraScale™ and UltraScale+ device portfolios.
2016.04.21by
Xilinx Introduces Open Acceleration Framework to Data Centers and Other Markets
Xilinx announced that it is collaborating with AMD, ARM, Huawei, IBM, Mellanox, and Qualcomm Technologies, a subsidiary of Qualcomm, to introduce a high-performance open acceleration framework in data centers. These companies are working together on specifications for a new CCIX (Cache Coherent Interconnect for Accelerators) for accelerators. For the first time in the industry, through a single interconnect technology specification, processors using different ISAs (instruction set architectures) can now uniformly share data through accelerators, enabling efficient heterogeneous computing and significantly improving the computational efficiency of servers executing data center workloads.
2016.05.25by 명세환 기자
Xilinx Expands 16nm UltraScale+ Product Roadmap for Data Centers
Xilinx announced an expansion of its 16nm UltraScale+™ product roadmap for data centers. The roadmap includes new acceleration-enhanced technologies. Through a powerful combination of Xilinx's 16nm FinFET+ FPGA and integrated High-Bandwidth Memory (HBM), it also supports the recently announced CCIX (Cache Coherent Interconnect for Acceleration) technology. CCIX is a technology developed through collaboration of seven companies to drive an acceleration framework across various initial processor architectures.
2016.05.27by 명세환 기자
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
반도체 전문 기업 로옴(ROHM)이 10Gbps를 넘어서는 차세대 고속 데이터 통신 환경에 대응할 수 있는 ESD(정전기 방전) 보호 다이오드 ‘RESDxVx 시리즈’를 개발하며, 고속 인터페이스에서 요구되는 신호 품질 유지와 IC 보호 성능을 동시에 끌어올렸다.
2026.03.26by 배종인 기자
