Roadlink chipset provided for next-generation intelligent transportation system between Sejong and Daejeon.
Providing highly reliable communication connections with secure solutions

NXP Semiconductors and ESSYS (CEO Yong-Beom Kim) announced that they will jointly participate in the first domestic 'Next Generation Intelligent Transport System (C-ITS)' pilot project promoted by the Ministry of Land, Infrastructure and Transport.

NXP will participate in the C-ITS pilot project by integrating its RoadLink chipset, a vehicle-to-vehicle/vehicle-to-infrastructure communication (V2X) solution, into the Wave communication solution of ESys, a domestic automotive electrical system specialist.

NXP's V2X expertise, already proven through various projects worldwide, is expected to significantly contribute to the completion of this pilot project, as it is incorporated into ESSYS's C-ITS solution. In particular, NXP's high-security secure solution enables secure connections without concerns about hacking, providing a high level of reliability.

This pilot run will be conducted from July 2016 to July 2017 on a total of 87.8 km of roads between Sejong and Daejeon. The existing ITS installed on highways nationwide provides information centrally, limiting its ability to respond quickly to emergencies. On the other hand, the newly introduced C-ITS enables individual vehicles to provide real-time information through road and vehicle-to-vehicle communication systems, enabling proactive response and prevention of unexpected situations.


Lars Reger, CTO, NXP Semiconductors

V2X technology can detect obstacles beyond the driver's view, even on the other side of a corner, thereby improving road safety, reducing CO2 emissions, and facilitating smooth traffic flow. According to the National Police Agency, more than 5,000 people die in traffic accidents each year, and over 300,000 are injured. Traffic congestion costs the government approximately 31 trillion won annually. The Korea Transport Institute estimates that fully implementing C-ITS could reduce overall traffic accidents by approximately 76%.

"As a specialist in automotive electrical systems, ESIS is committed to providing automakers and technology suppliers with communication modules that deliver optimal performance at a more cost-effective price," said Yongbeom Kim, CEO of ESIS. "ESIS's Wave communication solution, powered by NXP's globally proven RoadLink chipset, is expected to play a key role in the C-ITS business."

NXP is already providing V2X solutions around the world. Recently, it is providing an intelligent traffic management system to Columbus, Ohio, USA, which was selected for the U.S. Department of Transportation's Smart City Challenge, and in April, it successfully demonstrated autonomous truck driving technology using V2X technology at the 'European Truck Platooning Challenge' hosted by the Netherlands Ministry of Infrastructure and Environment.

NXP's RoadLink V2X communication and security technology is essential for the continued development and advancement of autonomous vehicles and macro-level traffic management. This technology wirelessly exchanges information such as speed, location, and direction between nearby vehicles, and provides traffic control data, speed limits, traffic signals, roadwork warnings, and hazard warnings between vehicles and infrastructure. Security elements are integrated into the chipset, protecting driver privacy against hacking and manipulation.

“We are honored that NXP’s Roadlink chipset, a globally recognized V2X solution, has been adopted by the Ministry of Land, Infrastructure and Transport for its next-generation intelligent transportation system,” said Shin Bak-je, Chairman of NXP Semiconductors. “We hope that NXP will contribute to the advancement of ITS technology in Korea through this pilot project, and the additional experience gained through this project will be of great help to NXP in providing technologies that can create safer, smoother, and more comfortable transportation, prevent accidents, and save lives.”

NXP is collaborating with major automotive OEMs and partners, including Siemens, Harman, Delphi, and Cohda Wireless, on V2X technology.