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TI Begins Mass Production of Wireless MCU Expanding IoT Network Capabilities

Google 우선 소스Published2016.09.20 12:13
Industry's First Ultra-Low Power Dual-Band Wireless MCU
Single-Chip Sub-1GHz and Bluetooth Low Energy Solution


TI is beginning mass production of the industry's lowest power dual-band wireless microcontroller (MCU) that supports Sub-1GHz and Bluetooth Low Energy connectivity on a single chip to expand Internet of Things (IoT) network capabilities.

TI's new SimpleLink dual-band CC1350 wireless MCU is part of the SimpleLink™ ultra-low power platform family with pin-to-pin and software compatibility, enabling developers to convert a three-chip solution into an ultra-compact single chip while reducing design complexity and saving power, cost, and board space.

The CC1350 wireless MCU provides a maximum range of 20km with a coin cell, making it suitable for building and factory automation, alarm and security, smart grid, asset tracking, and wireless sensor network applications.

Designed for low-power wide-area networks (LPWAN), the CC1350 wireless MCU extends Sub-1GHz network capabilities with Bluetooth Low Energy implementations such as beacons, over-the-air (OTA) updates, smart commissioning, and remote displays.

Additionally, the combination of long-range connectivity and ultra-low power consumption enables battery operation for more than 10 years with 0.7μA sleep current. In particular, the Sub-1GHz transceiver, Bluetooth Low Energy radio, and ARM® Cortex®-M3 core are integrated into a single, flash-based, 4x4 mm QFN package.

Developers can begin development in just a few minutes using the affordable SimpleLink CC1350 wireless MCU LaunchPad™ development kit, and can connect sensors to the cloud in just a few minutes using the SimpleLink CC1350 SensorTag demo kit, which is supported by TI's Code Composer Studio™ integrated development environment (IDE) and IAR Embedded WorkBench®.

Additionally, TI provides various software options to simplify development work, including P2P (point-to-point) communication examples using EasyLink, wireless M-Bus protocol stack using TI RTOS, and BLE-Stack 2.2 software development kit (SDK) supporting Bluetooth 4.2 specifications. Developers can also receive assistance in their design process through online training and the E2E™ community.
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