From terminals to system semiconductor solutions

Samsung Electronics will showcase a variety of mobile devices, services, solutions, and next-generation communication technologies at Mobile World Congress 2017.

Samsung Electronics plans to target the premium tablet market by introducing three premium tablets (Galaxy Tab S3, two Galaxy Books) at this year's MWC.



Samsung Electronics also plans to unveil a new Gear VR product (Gear VR with Controller) that will offer an interactive virtual reality experience. The Gear VR product features built-in gyroscopes and accelerometers to provide a VR viewing experience, and a motion-sensitive controller to enable interactive games.

Samsung Electronics also plans to provide visitors with a 'VR 4D Experience Zone' where they can experience 360-degree stereoscopic images, demonstrating the enjoyable experience of virtual reality.

In addition, VR/AR technologies such as Relumino, Buildus, Traveler, and Monitorless, which are being developed by Samsung Electronics' in-house venture C-Lab, will be introduced to visitors at the 4YFN exhibition hall.

Samsung Electronics will create a space where visitors can experience various services, including the mobile payment service Samsung Pay, Samsung Pass, S Health, and Kids Mode.

We also present corporate solutions with partners from various industries, including retail and finance. Samsung Electronics will showcase solutions that improve the performance of telecommunications networks and next-generation 5G wireless communication technology.

We will also introduce virtualization solutions like Network Slicing and a next-generation virtualized base station solution (RAN, Radio Access Network) that integrates 5G and LTE technologies to enable them to operate as a single network. We will also showcase a diverse product lineup, including LTE Femtocell, unlicensed LTE, public frequency LTE, and WiFi APs.

Samsung Electronics is producing memory semiconductors such as the 10nm-class '8GB LPDDR4X (Low Power DDR4X) mobile DRAM', high-bandwidth memory '8GB HBM2 (High Bandwidth Memory) DRAM', and consumer M.2 NVMe SSD '960 PRO 2TB', as well as system semiconductors such as the premium AP 'Exynos 9' that uses the cutting-edge 10nm logic process.
Present to customers.

In particular, the 10nm-class 8GB LPDDR4X is provided as a 'high-speed, large-capacity, ultra-low power' solution suitable for next-generation mobile devices, and the 8GB HBM2 DRAM solution tailored to the computing environment where market demand is rapidly expanding is also introduced.

In addition to 'Exynos', various system semiconductor solutions that can be installed in smartphones, VR devices, and vehicle infotainment systems will also be showcased.