NXP Semiconductors announced the launch of a new RF front-end solution for 5G infrastructure implementation.

Creating cellular infrastructure for massive multiple-input, multiple-output (mMIMO) and, increasingly, 5G is challenging. The new NXP portfolio addresses the most challenging challenges, including power amplifier integration, board space reduction, and true footprint and pin compatibility between transformers.

mMIMO serves as an essential foundation for 5G implementation. mMIMO addresses the network requirements for radio frequency (RF) technology that can handle the dramatic increase in data usage as it becomes commercially available.

NXP's mMIMO shield board

mMIMO addresses the explosion of data usage by enabling the transmission of far more data than existing radio frequency technologies allow.

NXP's new front-end solution for 5G, unveiled at the International Microwave Symposium (IMS 2018), addresses the critical challenge of delivering cost-effective, high-performance solutions in ultra-small form factors.

This is essential for demonstrating next-generation active antenna systems (AAS). Simply put, it means integrating everything needed for mMIMO into a single, ultra-compact box.

NXP offers a portfolio of highly integrated solutions featuring increasingly smaller form factors. This addresses the challenges associated with 5G implementation and enables customers to easily plug-and-play across all frequency bands and power levels in a cost-effective manner.

“The new solution has been developed to help customers design their systems at the lowest cost,” said Mario Bokatius, product line director for front-end solutions at NXP.

NXP front-end solutions support the critical frequency range of 2.3 GHz to 5 GHz, which is essential for the early stages of 5G cellular network development.

NXP's front-end solution for 5G implementation consists of three functions required to create an RF front-end for mMIMO.

• High-efficiency power amplifier modules (PAMs) are fully matched to 50 Ohm at the input and output, with footprint and pin compatibility to support a variety of power levels and frequency bands with the same board design.

• The pre-driver amplifier module features ultra-low power consumption, supports a frequency range of 2.3 GHz to 5 GHz, and offers full footprint and pin compatibility within the family.

• The receiver front-end module provides integrated time division duplex (TDD), switching, and low noise amplification (LNA) functions for signal reception.

“NXP offers the highest level of integration without compromising high-performance requirements,” said Bokatius. “But this is just the beginning. NXP’s commitment to delivering the industry’s smallest footprint and lowest-cost solutions will continue, and customers will experience even greater integration with our products.”