SK Hynix Launches '2 Trillion Won Export Supply Chain Strengthening Guarantee' Program for Materials, Parts, and Equipment Support
SK Hynix has launched a 2 trillion won-scale financial support program for small and medium-sized semiconductor materials, parts, and equipment compan…
2026.10.19 by 배종인 기자
Xcena Demonstrates CXL-based AI Inference Memory Solution at OCP Summit
Fabless company Xcena unveiled AI inference technology utilizing CXL-based memory solution 'MX1' at OCP Global Summit 2026. In collaboration with SK H…
2026.10.16 by 배종인 기자
SK Hynix Unveils Next-Generation Memory Hierarchy Optimization Strategy at SEDEX 2026
SK Hynix diagnosed new memory bottleneck issues arising from the expansion of the AI inference market at SEDEX 2026 and disclosed resolution strategie…
2026.10.14 by 배종인 기자
Applied Materials Unveils $5 Billion EPIC Center in Silicon Valley
Applied Materials has opened a $5 billion EPIC (Equipment, Process Innovation, and Commercialization) center in Silicon Valley. Major semiconductor ma…
2026.10.13 by 배종인 기자
SK Group Chairman Choi Tae-won Directly Inspects Gwangju Semiconductor Cluster Site
SK Group Chairman Choi Tae-won directly inspected the planned semiconductor specialized complex site in Jeollanam-do·Gwangju Integrated Metropolitan C…
2026.10.12 by 배종인 기자
SK Hynix "No Confirmed Matters Related to Solidigm"
SK Hynix stated that there are currently no confirmed matters regarding capital utilization plans related to Solidigm, and all decisions will be made …
2026.10.01 by 배종인 기자
Semiconductor investment momentum shifts from front-end to back-end
The flow of semiconductor investment is shifting from front-end to back-end and packaging-focused processes. Global companies are concentrating on HBM…
2026.08.28 by 배종인 기자
AI Agents Trigger 'Memory Supercycle'
At the 'Dell Technologies Forum 2026', SK Hynix Vice President Joo Young-pyo emphasized that as AI proliferation advances, memory bandwidth and effici…
2026.08.28 by 배종인 기자
SK Hynix Breaks Ground on U.S. Indiana HBM Production Base...Mass Production of 'Made in USA' HBM in 2029
SK Hynix announced that it held a groundbreaking ceremony on the 27th (local time) for an advanced packaging production facility for AI memory in West…
2026.08.28 by 배종인 기자
SK Hynix Unveils Next-Generation AI Infrastructure Blueprint Based on Optical Interconnect
SK Hynix has disclosed its CPO (Co-Packaged Optics) roadmap, a core technology for next-generation AI infrastructure, to Nature Electronics. To addres…
2026.08.21 by 배종인 기자
[EDA Great Transformation ③] Korea Was Already in the Midst of the EDA War
Competition among global EDA companies is intensifying in the Korean market, centered on Samsung's 2nm and HBM and 3D stacking. AI-based design automa…
2026.08.12 by 배종인 기자
SK Hynix Decides on 54 Trillion Won Investment in Yongin Y2 and Cheongju M17
SK Hynix will invest a total of 54 trillion won in Yongin and Cheongju to construct new semiconductor fabs in response to expanding AI demand. The Yon…
2026.08.10 by 배종인 기자
SanDisk Unveils AI Inference Technologies Including HBF™ and BiCS10 NAND at FMS 2026
SanDisk disclosed next-generation technologies for AI inference workloads at FMS 2026. The company showcased BiCS10 QLC NAND and a new HBF™ (High Band…
2026.08.06 by 명세환 기자
SK Hynix and SanDisk Unveil First HBF Standard Specification…Presenting AI Memory Strategy at FMS 2026
SK Hynix and SanDisk have unveiled the first standard specification for HBF (High Bandwidth Flash). Finalized within six months, this specification su…
2026.08.05 by 배종인 기자
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SK Hynix Introduces 'Half-Day In-depth Interview'... Reorganizes Recruitment Based on AI Competency
SK Hynix will begin new continuous recruitment starting August 20 and has completely restructured its hiring system centered on AI utilization capabil…
2026.07.30 by 배종인 기자