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ST Ships 1 Billionth ToF Module
Applied to 150 types of smartphones
The adoption rate of ToF sensors in smartphones appears to be increasing dramatically.

STMicroelectronics announced on November 29 that it shipped its 1 billionth ToF module.
Time of Flight (ToF) is a technology that calculates distance by measuring the time it takes for a light source sent toward an object to reflect back. When combined with a camera, it can represent objects in three dimensions.
The process of recognizing objects in 3D is simple and is not affected by external light interference, resulting in a high recognition rate even outdoors. It has a fast response speed, making it highly useful.
ToF modules equipped with ST's SPAD (Single Photon Avalanche Diode) sensor technology are being produced at ST's 300nm front-end wafer fab located in Croll, France.
The final module, integrating the optical components, SAPD sensors, and VCSELs (Vertical Cavity Surface Emission Lasers) required to realize the product's performance, undergoes assembly and testing at ST's back-end facilities.
"ST's ToF modules are currently used in over 150 types of smartphones," said Eric Aussedat, Head of the ST Imaging Subgroup. "Recently, we added high-resolution 3D depth sensing capabilities to enable applications utilizing advanced proximity sensing, human presence detection, and laser autofocus."
Currently, ST is mass-producing the VL6180, VL53L0, and VL53L1 product families for the consumer, personal computer, and industrial markets.
Applied to 150 types of smartphones
The adoption rate of ToF sensors in smartphones appears to be increasing dramatically.
▲ ST Ships 1 Billionth ToF Module
(Image=STMicroelectronics)
(Image=STMicroelectronics)
STMicroelectronics announced on November 29 that it shipped its 1 billionth ToF module.
Time of Flight (ToF) is a technology that calculates distance by measuring the time it takes for a light source sent toward an object to reflect back. When combined with a camera, it can represent objects in three dimensions.
The process of recognizing objects in 3D is simple and is not affected by external light interference, resulting in a high recognition rate even outdoors. It has a fast response speed, making it highly useful.
ToF modules equipped with ST's SPAD (Single Photon Avalanche Diode) sensor technology are being produced at ST's 300nm front-end wafer fab located in Croll, France.
The final module, integrating the optical components, SAPD sensors, and VCSELs (Vertical Cavity Surface Emission Lasers) required to realize the product's performance, undergoes assembly and testing at ST's back-end facilities.
"ST's ToF modules are currently used in over 150 types of smartphones," said Eric Aussedat, Head of the ST Imaging Subgroup. "Recently, we added high-resolution 3D depth sensing capabilities to enable applications utilizing advanced proximity sensing, human presence detection, and laser autofocus."
Currently, ST is mass-producing the VL6180, VL53L0, and VL53L1 product families for the consumer, personal computer, and industrial markets.
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