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Vicor Announces ChiP-Set for High-Performance Processors
Reduce PDN loss by placing it close to the processor
Provided through the Byco Hydra II Evaluation Board
On the 14th, Vicor announced the launch of its 'ChiP-set' for high-performance GPUs, CPUs, and ASICs that run on 48V.
The MCM4609 current multiplier module, paired with the driver MCD4609, provides up to 650 A of continuous current and 1,200 A of peak current.
With a size of 45.7 mm × 8.6 mm × 3.2 mm, it can be placed close to the processor, reducing power distribution network (PDN) losses and increasing power system efficiency.
The 4609 ChiP-set, which drives the GPU and OAM (OCP Accelerator Module) AI cards, is currently in mass production and is available on the Vicor 'Hydra II' evaluation board.

The 4609 ChiP-set is part of Vicor's Power-on-Package (PoP) portfolio of Lateral Power Delivery (LPD) solutions, which will introduce Vertical Power Delivery (VPD) to increase current capacity beyond the limits of LPD solutions, enabling even higher current densities.
The VPD system Current is supplied from a power converter stacked vertically below the processor through a network of capacitors tuned to a pin map specific to the processor.
The Geared Current Multiplier (GCM) is a special VPD implementation that integrates a gearbox capacitor network in vertically stacked layers, allowing current densities of up to 2 A/mm2 to be achieved by supplying current directly under the processor and eliminating PDN losses.

By utilizing Vicor's IP in the core path of PoP LDP and VPD solutions, high current density and efficient current supply are possible for advanced processors in applications including AI accelerator cards, AI high-density clusters, and high-speed networking.
Reduce PDN loss by placing it close to the processor
Provided through the Byco Hydra II Evaluation Board
On the 14th, Vicor announced the launch of its 'ChiP-set' for high-performance GPUs, CPUs, and ASICs that run on 48V.
The MCM4609 current multiplier module, paired with the driver MCD4609, provides up to 650 A of continuous current and 1,200 A of peak current.
With a size of 45.7 mm × 8.6 mm × 3.2 mm, it can be placed close to the processor, reducing power distribution network (PDN) losses and increasing power system efficiency.
The 4609 ChiP-set, which drives the GPU and OAM (OCP Accelerator Module) AI cards, is currently in mass production and is available on the Vicor 'Hydra II' evaluation board.
▲ PoP AI Accelerator Card [Image = Byco]
The 4609 ChiP-set is part of Vicor's Power-on-Package (PoP) portfolio of Lateral Power Delivery (LPD) solutions, which will introduce Vertical Power Delivery (VPD) to increase current capacity beyond the limits of LPD solutions, enabling even higher current densities.
The VPD system Current is supplied from a power converter stacked vertically below the processor through a network of capacitors tuned to a pin map specific to the processor.
The Geared Current Multiplier (GCM) is a special VPD implementation that integrates a gearbox capacitor network in vertically stacked layers, allowing current densities of up to 2 A/mm2 to be achieved by supplying current directly under the processor and eliminating PDN losses.

▲ Hydra II Evaluation Board [Image = Byco]
By utilizing Vicor's IP in the core path of PoP LDP and VPD solutions, high current density and efficient current supply are possible for advanced processors in applications including AI accelerator cards, AI high-density clusters, and high-speed networking.
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