e 4 ds News Summary of ICT news in the Greater China region
Monday, August 30, 2021 [China Briefing]



semiconductor field

The first transportation of industrial workers,
苹果明年 iPhone New 新机恐难采用 3nm 芯片
TSMC, which has hit a snag with its 3nm process, is likely to move to 4nm technology next year.


Current research: 27.56%
Half a year ago, the first high water level
China's Wingtech achieves record-high semiconductor profitability in the first half of the year.


Is NWF really right?
British economic policy: people's income
Wingtech affiliates in China and Nexperia complete acquisition of UK foundry.



semiconductor equipment sector

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The semiconductor testing market dominated by Taiwan holds promise for materials analysis (MA).


盛美半导体设备发布高速铜电镀技术
提高先进封装应中的镀铜速率和均一性
ACM Announces Copper Plating Technology Suitable for Semiconductor Equipment


瞄準半導體設備市 Hua景電積極搶市
Taihua Jing targets the semiconductor equipment market with AMC control equipment.



Automotive sector

解锁电动汽车重要一环：The performance is limited to 100% of the total cost.
Automotive power semiconductors have become key areas of the electric vehicle business.


半導體測試廠欣銓 力拼全年營收破百億
Taiwan's Ardentec posts record-breaking sales in automotive chip testing



strong>Consumer sector

華為Mate 50已經進入測試階段，
搭載麒麟和驍龍處器，但5G…
Huawei's 5G flagship phone, the Mate 50, is expected to be announced next year.


Surface Duo 2 跑分流出，S888 處理器確認
Microsoft Surface Duo 2 expected to feature Qualcomm S888 AP