Wafer production for power and compound semiconductor manufacturing is expected to continue increasing, with forecasts indicating a breakthrough to 10 million units per month in 2023.

SEMI recently released the 'Power & Compound Fab Report to 2024.' According to this, global power and compound semiconductor production volume is expected to reach 10.24 million wafers per month in 2023, followed by an increase to 10.60 million units per month in 2024.

Regionally, China is expected to account for the largest production share at 33% through 2023, with Japan at 17%, Europe and the Middle East at 16%, and Taiwan at 11%.

In 2024, approximately 360,000 units of additional monthly production capacity is expected compared to 2023, which appears to result in slight changes in regional production ratios.

According to SEMI's report, from 2021 to 2024, 63 companies are expected to add 2 million wafers of monthly production capacity. In particular, Infineon, China Wafer Level CSP Co. Ltd., STMicroelectronics, and Silan Microelectronics are expected to lead growth by adding 700,000 wafers of monthly production capacity.

Production volume of power and compound fabs showed growth of 5% in 2019 and 3% in 2020, followed by an expected sharp increase to 7% in 2021.

Subsequently, 6% growth is expected in 2022 and 5% growth in 2023, after which monthly wafer production of 10 million units is forecast for the first time in 2023.

From 2021 to 2024, 47 additional production facilities are expected to begin operations, increasing the industry's power and compound semiconductor production facilities to 755 total.

However, if new production facility investments are announced, current forecasts could be exceeded.

SEMI's 'Power & Compound Fab Report' cited in this announcement has been tracking 957 power and compound semiconductor production facilities operating over a 12-year period from 2013 to 2024, which includes closed facilities, facilities scheduled for closure, and newly constructed facilities.