Infineon Technologies (Korea CEO Seung-Soo Lee) announced that its new EasyPACK™ 2B EDT2 power module for 50kW traction inverters offers 20% better performance than its predecessor.

Infineon announced on the 13th the launch of EasyPACK™ 2B EDT2, a flexible and scalable automotive half-bridge power module.

The 750V EDT2 device has a maximum power of 50kW and 230Arms depending on inverter conditions, making it suitable for inverter applications in hybrid and electric vehicles.

Over the past decade, Infineon has shipped more than 50 million EasyPACK modules featuring a variety of chipsets for industrial and automotive applications.

By applying EDT2 (Electric Drive Train) technology to this package and receiving automotive certification, Infineon expands the application range of its EasyPACK module family to traction inverters.

The most significant feature of EDT2 technology is that it achieves higher efficiency under light load conditions.

The EDT2 chip significantly reduces losses compared to other products currently on the market and delivers 20 percent better performance than Infineon's previous generation chips.

EasyPACK has a plug-and-play approach that simplifies module integration.<br />
Additionally, compared to conventional through-hole discrete packages or HybridPACK™ 1 packages, PressFIT technology eliminates the need for soldering pins, reducing system assembly time.

Additionally, the compact package size means that three EasyPACK 2Bs occupy 30 percent less space than one HybridPACK 1.

This allows for a highly compact and cost-effective design. The EasyPACK 2B EDT2 fully complies with the AQG324 standard.

The new EasyPACK 2B EDT2 module FF300R08W2P2_B11A will be available from October 2021.