Texas Instruments (TI) is set to begin construction of a 300mm semiconductor wafer production plant next year, which is expected to strengthen its long-term manufacturing capabilities and improve its supply chain management capabilities.

TI announced on the 18th that it plans to build a new 300mm semiconductor wafer manufacturing plant in Sherman, Texas, and begin construction next year.

TI's Sherman site in northern Texas can accommodate up to four semiconductor fabs, and is expected to meet the growing demand in the semiconductor market, led by industrial and automotive semiconductors.

The first and second semiconductor fabs are scheduled to begin construction in 2022.

Rich Templeton, Chairman, President, and CEO of Texas Instruments, stated, “The 300mm analog and embedded processing fab to be built at the Sherman site is part of a long-term plan to strengthen manufacturing capabilities to enhance TI’s manufacturing and technological competitiveness and support customer demand for decades to come. We have been committed to North Texas for over 90 years, and this decision demonstrates our strong partnership and investment in the Sherman community.”"That is evidence," he said.

The first production at the first semiconductor fab is expected to begin in 2025. The potential investment value of the Sherman site, capable of accommodating up to four semiconductor fabs, reaches approximately $30 billion and is expected to create 3,000 new jobs over time.

The new semiconductor fab is set to complement TI's existing 300mm semiconductor fabs, including DMOS6 in Dallas, Texas, RFAB1 in Richardson, Texas, and RFAB2, which is set to begin production in the second half of 2022. Additionally, LFAB in Lehi, Utah, which TI recently acquired, is expected to begin production in early 2023.