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Hyundai Mobis CEO Cho Sung-hwan: "Mobility is all about MECA, software, and semiconductors."

'Car safety devices' must satisfy a zero defect rate.
Downsizing technology and security will become increasingly important.
Hyundai Mobis CEO Cho Sung-hwan said that MECA, software, and semiconductors are the key factors that will define the future mobility industry, and that the automobile and semiconductor industries will experience further changes and advancements.
At 'SEMICON Korea 2022' held online, Hyundai Mobis CEO Sung-Hwan Cho delivered a keynote speech on the topic of 'Semiconductors in the Future Mobility Industry.'
CEO Cho said that automobiles and semiconductors have a close relationship.
While the COVID-19 pandemic has been cited as a major factor in the semiconductor shortage that has been occurring since the end of 2020, it was also revealed that incorrect predictions of semiconductor demand and the automobile industry were also a major reason.
Due to supply chain complexity, climate change, politics, and economics, an unprecedented decline of more than 10 million automobiles occurred last year.
This is a clear example of how semiconductors have a significant impact on the automotive industry.
CEO Cho chose MECA, software, and semiconductors as the most important keywords in the automobile and semiconductor industries.
MECA is an irreversible trend in the automotive industry created by Industry 4.0, regulatory advancements, and climate change.
/> M stands for Mobility, E for Electrification, C for Connectivity, and A for Autonomous Driving.
CEO Cho explained that the foundation of the technology that provides MECA to consumers is software, and that in the future automotive mobility industry where software and hardware are provided separately, software differentiation will be a key factor in determining the competitiveness of device operation.
In addition, securing and developing semiconductor technology that supports software development and forms the platform that enables its operation is essential.
The requirements for semiconductors in future mobility are: △optimization and high performance, △downsizing, and △security.
“Cars are safety devices,” said CEO Cho, adding that they must meet stringent quality standards.
It must operate perfectly under all conditions, including -40℃ to 150℃ and 0% to 100% relative humidity, and must be reliable enough to achieve a zero defect rate.
It must be able to satisfy all safety standards, including AEC-Q100, functional and safety standards, ISO26262, and cybersecurity standards, ISO21434.
To enter the early stages of Level 3 autonomous driving technology in the future, the performance of semiconductors must also be significantly improved.
He said that Core Performance should be improved to 450kDMIPS, which is 2.5 times higher than the current 180kDMIPS, NPU Performance should be improved to over 500TOPS, and Memory Bandwith should be improved to 410GB/s, which is 1.6 times higher than the current 256GB/s.
Downsizing technology to reduce the size of controllers and the importance of security are also expected to increase.
E/E architectureAs the architecture evolves from a distributed to a zonal architecture, the importance of security and stability increases as components and controllers are expected to be concentrated to take on higher performance and roles.
CEO Cho stated that system semiconductors will also integrate various functions and handle a lot of work in a small size, and that preparation for cybersecurity is essential.
Hyundai Mobis CEO Cho Sung-hwan said, “MECA, software, and semiconductors will continue to develop in an inseparable relationship,” adding, “This model will become the core that defines the future mobility industry.”
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