ACM Research, Inc., a specialist in wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has entered the power semiconductor market with the first purchase order for its Ultra C equipment for cleaning SiC substrates.

ACM announced on the 20th that it has received the first purchase order (PO) for Ultra C equipment for SiC substrate cleaning through its subsidiary ACM Shanghai.

This platform leverages ACM's patented Space Alternated Phase Shift (SAPS) technology to provide comprehensive cleaning without compromising equipment functionality. The PO was obtained from a leading silicon carbide (SiC) substrate manufacturer in China, and equipment is expected to be delivered by the end of the third quarter of this year.

SiC substrates are essential components for manufacturing power semiconductors used in diverse fields such as power conversion, electric vehicles (EVs), and renewable energy. SiC-based technology offers numerous advantages, including reduced switching power losses, higher power density, better heat dissipation, and improved bandwidth capabilities. According to Yole Développement, increasing demand for power semiconductors in various industries such as automotive and renewable energy is driving the growth of the SiC device market, which is expected to exceed USD 4 billion by 2026.

“The power semiconductor market is experiencing strong growth driven by the acceleration of electric vehicle (EV) deployment and associated charging infrastructure,” said David Wang, ACM’s founder and CEO. “This order demonstrates that ACM’s extensive experience and expertise in advanced semiconductor wafer processing equipment is being successfully applied to meet the unique requirements of SiC substrate manufacturing. ACM plans to expand its product portfolio to support additional market opportunities.”