The AI Accelerator War: HBM3 to Rise Rapidly in 2024
Published2023.08.03 13:30Market research firm TrendForce stated on the 1st that new HBM3 and HBM3e will become mainstream in the market in 2024, citing increasing demand for AI accelerator chips and a trend of companies developing their own chips. To avoid Nvidia's growing influence, the industry has recently been focusing on developing its own AI chips. As demand for AI accelerator chips evolves, growth in HBM3 and HBM3e is expected.
Comments 1
1 Comments:
Related news
SK Hynix Develops HBM3, the Fastest DRAM to Date
SK Hynix has developed the industry's highest-specification DRAM capable of processing data equivalent to 163 ultra-high-definition movies in just 1 second, and is expected to be utilized in high-performance data centers, machine learning, and supercomputers.
2021.10.20by 배종인 기자
[Planning-Chat GPT3③] AI Semiconductor and Data Center Market ‘Active’
Investment in key AI market infrastructure, including domestic and international AI semiconductors and data centers, is being accelerated. Samsung Electronics has been continuously advancing 'HBM-PIM,' which combines memory semiconductors and AI processors into one unit, since 2021. SK Hynix has succeeded in developing 'HBM3,' a next-generation stacked memory optimized for AI inference and learning performance. Data centers provide cloud computing services capable of collecting, storing, and analyzing big data, and are well-suited for training AI models. Domestically, investment in data centers for securing stable infrastructure is accelerating alongside AI semiconductor development.
2023.03.06by 김예지 기자
SK Hynix Develops Highest Capacity 24GB 12-Layer Stacked HBM3
SK Hynix has developed 'HBM3', a 24GB 12-stacked DRAM with the highest performance and capacity available, reinforcing its leadership in the cutting-edge DRAM market.
2023.04.20by 배종인 기자
Intel Xeon, HBM combination solves massive data processing
The volume of data demanded by devices such as automobiles that function with artificial intelligence technology and software is rapidly increasing. As market demand rises for technologies that can respond to growing data volumes and effectively leverage such data, memory speed that supports processors has become essential not only to satisfy data processing speed but also to meet the capacity of data that can be processed.
2023.06.12by 명세환 기자
.jpg)
SK Hynix, deficit ↓ with HBM3 and DDR5, recovery expected in the second half
Memory semiconductor results in the second quarter recorded consecutive losses due to sluggish demand recovery in consumer-oriented products such as mobile and PC as well as general servers. However, with the booming AI server market, orders are expanding in high-value-added product lineups such as HBM3 and DDR5, with gradual recovery anticipated.
2023.07.26by 명세환 기자
기대하겠습니다