As compound semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) are emerging as future food sources, solutions that reduce processing loads while performing precision processing in advanced materials are also achieving technological advancements.

DMG Mori Korea Open House 2023 was held on the 21st at the DMG Mori Korea Tech Center in Seoksu-dong, Anyang.

This two-day event featured seminars on semiconductor and aerospace technology, as well as a showroom tour, introducing DMG MORI’s total solutions to support the semiconductor industry.

Jang Gu-young, managing director of DMG Mori Korea, said, “DMG Mori not only provides milling but also material lamination and fusion solutions, and provides processing solutions for materials that are difficult to process, such as silicon and silicon carbide.” He added, “The biggest concern in the industry is the lack of manpower and highly skilled workers.“We have improved the ease and efficiency of machine operation by providing automated solutions and a cycle in four sections,” he emphasized.

DMG MORI introduced its ultrasonic processing technology that can be used in semiconductor processes. Ultrasonic machining is a machining process that removes and polishes material from the surface of a part using high-frequency, low-amplitude vibrations. The advantages of ultrasonic machining include: △machining without damaging brittle materials; △40% reduction in cutting stress; △reduction in cracks on the surface after machining; △reduction in risk of cooling and heat damage; and △high precision.

In particular, advanced materials such as silicon carbide are one of the most difficult areas to process, and DMG Mori is said to be seeking to simultaneously improve technological accuracy and productivity through automation of precision processing.

Professor Hwang Wan-sik of the Department of Materials Engineering at Korea Aerospace University emphasized the emergence and vision of compound power semiconductors such as SiC and GaN that are more efficient than silicon in the seminar, and predicted that the need for high-bandgap semiconductors with radiation resistance and resistance to operational errors due to high particle energy will increase in particular in preparation for the aerospace era.

While Japan is currently leading the material technology related to compound semiconductors, Professor Hwang emphasized the need to foster material technology and industry for future semiconductor competition, saying, “A gallium oxide the size of a fingernail costs over 10 million won.”

As domestic voices calling for the fostering of next-generation power semiconductors grow louder, attention is being paid to whether DMG Mori, which provides precision processing of advanced materials such as silicon carbide, will establish itself as a key player in the future growth market.