HBM4 to be launched in 2026… “HBM on GPU”
Published2023.11.30 16:53HBM (High Bandwidth Memory), which has emerged to revolutionize processing speed, is a high-bandwidth memory that vertically connects multiple DRAM chips using TSV (Through Silicon Via) technology. The HBM market is dominated by Samsung Electronics and SK Hynix, with Micron following behind. According to TrendForce, last year's global HBM market share was SK Hynix at 50%, Samsung Electronics at 40%, and Micron at 10%. HBM4, which will be released in 2026 to meet demand from cloud service providers (CSPs) such as NVIDIA, Amazon, Google, and Microsoft, will introduce methods different from current semiconductors.
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