Vertiv's liquid-cooled data center infrastructure solutions support Intel's next-generation AI accelerators, helping enterprises achieve their sustainability goals and accelerate AI adoption.

Vertiv, a company specializing in critical digital infrastructure and continuity solutions, announced today that it is collaborating with Intel to provide a liquid cooling solution to support the innovative new Intel Gaudi3 artificial intelligence (AI) accelerator, scheduled for launch in 2024.

As AI applications and high-performance computing (HPC) generate greater amounts of heat, more and more companies are turning to liquid cooling solutions for more efficient and environmentally friendly cooling methods.

The Intel Gaudi 3 AI accelerator supports both liquid-cooled and air-cooled servers and will be supported by Vertiv™ pumped two-phase cooling infrastructure.

This liquid cooling solution has been tested for accelerator powers up to 160 kW using facility water temperatures ranging from 17°C to 45°C (62.6°F to 113°F).

The air-cooled solution has been tested for a heat load of 40kW, enabling deployment in data centers with indoor air temperatures up to 35°C (95°F).

This medium pressure direct P2P Refrigerant-based cooling solutions enable customers to implement heat reuse, hot water cooling, and free air cooling while reducing power usage effectiveness (PUE), water usage effectiveness (WUE), and total cost of ownership (TCO).

“The Intel Gaudi 3 AI Accelerator provides the perfect solution for Vertiv’s collaboration with Intel,” said John Niemann, senior vice president and general manager of Vertiv’s global temperature and humidity business. “As we continue to expand our extensive liquid cooling portfolio, Vertiv is better positioned to support next-generation AI technology leaders like Intel. We are helping our customers accelerate AI adoption quickly and reliably while also achieving their sustainability goals.”

“The compute required to handle AI workloads has made performance, cost and energy efficiency top of mind for enterprises today,” said Dr. Devdatta Kulkarni, Intel’s principal engineer and lead thermal engineer on the project. “To support the increasing thermal design power and heat flux for next-generation accelerators, Intel has collaborated with several ecosystem partners, including Vertiv, to implement innovative cooling solutions that will play a critical role in helping customers achieve their key sustainability goals.”