Applied Materials, a global leader in materials engineering solutions, presents the direction of high-bandwidth memory and future memory materials engineering.


Applied Materials will present its memory chip process equipment and technological advancements at the International Memory Workshop (IEEE IMW) 2024, held at the Grand Walkerhill Hotel in Seoul from May 12 to 15.

'IMW 2024 (International Memory Workshop 2024)' is a prestigious annual international conference on memory technology hosted by the IEEE Electron Devices Society, where engineers and researchers from around the world gather to discuss the latest advancements in memory devices, processes, design, and packaging technologies.

This year marks the 16th anniversary and the second time it is held in Korea.

Applied Materials will present four papers at this workshop highlighting innovations in materials engineering, including: Gate-All-Around (GAA) SRAM: Performance Investigation and Optimization for Vccmin Scaling; Demonstration of High-Growth-Rate Epitaxially Grown Si Channels in Memory-Functional 3D NAND Vehicles; Self-Commutating Nonvolatile Tunneling Synapses: Development of Multiscale Model Augmentation; and Die-to-Wafer Hybrid Bonding Challenges to Address Next-Generation Heterogeneous Integration Challenges for High-Bandwidth Memory..

He will also participate in a panel discussion on the topic of 'Advanced Channel Materials for Memory Applications'.

Applied Materials has supported IMW for over 10 years and will participate as a Premier Sponsor at this year's event.

Detailed information about the program schedule and how to participate in Applied Materials can be found on the Applied Materials website.