첨단 디바이스 개발 추세가 소형화·다기능·배터리 기반 등으로 흘러가면서 제품 내 칩-칩, 칩-부품 간 배치는 출퇴근길 9호선 급행열차 내부처럼 빼곡하게 들어차고 있다. 이에 EMI 이슈가 증가하면서 패키징·소재적인 해법으로 대응책 마련을 고심하고 있다.
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