Infineon Technologies (Korea Representative Lee Seung-soo) has been recognized as a key partner of the global automotive parts company Bosch.

Infineon announced on the 23rd that it had won the 'Bosch Global Supplier Award 2025'.

This award is the result of Infineon's technological innovation and product development capabilities in the fields of microcontrollers (MCUs) and power semiconductors being highly recognized in the 'Materials and Components' sector.

Every two years, Bosch selects the best suppliers from among approximately 35,000 suppliers worldwide based on various criteria such as quality, cost, sustainability, and innovation.

This year, 49 companies from 14 countries received the honor, and with this being its fifth win, Infineon has once again demonstrated its technological prowess and partnerships in the field of automotive electronics.

Peter Schiefer, President of Infineon Automotive, said, “This award is the result of Infineon’s commitment to innovation, quality, and operational excellence, and is strong evidence of our close partnership with our customers.”"We will continue to develop advanced solutions that accelerate the transition to SDVs (Software Defined Vehicles)," they stated.

Arne Flemming, Bosch’s Head of Supply Chain Management, explained, “The Bosch Global Supplier Award is given to the best suppliers who strengthen Bosch’s competitiveness and innovation capabilities even in challenging market environments.”

Infineon has played a key role in building an evolving electrical/electronic (E/E) architecture based on SDV by developing several generations of MCUs together with Bosch.

Infineon's automotive semiconductor portfolio spans diverse fields including control, connectivity, analog, sensors, and power, providing extensive support to global customers based on a deep understanding of systems and application expertise.

In addition, Infineon was highly regarded for its investment in manufacturing technology and capabilities. It is leading next-generation semiconductor technology by focusing not only on the production of high-efficiency 300mm silicon wafers but also on wide bandgap (WBG) materials such as gallium nitride (GaN) and silicon carbide (SiC).

There are plans to complete a new 300mm Smart Power Fab in Dresden, Germany in 2026.