[Editor's Note] ASMPT, a Singaporean semiconductor packaging equipment specialist established in 1975, showcased various equipment and solutions designed to respond to the growth of the AI industry at Semicon Korea 2026. In particular, the laser diving grooving system equipped with an automated cleanroom mini environment, MEGA equipment supporting photonics and multi-chip module assembly, and DALA equipment for the CIS field attracted the attention of domestic semiconductor companies and industry stakeholders. Accordingly, this publication met with Kenneth Koh, Strategic Marketing Director at ASMPT, at the Semicon Korea 2026 venue to hear about the company's plans for the Korean semiconductor market.


■ Please introduce ASMPT.

ASMPT is a semiconductor packaging equipment company located in Singapore. It was founded in 1975. Last year, in 2025, it marked its 50th anniversary.

ASMPT is a partner for backend packaging and SMT for semiconductor manufacturers.

As mentioned earlier, we have two types of customers: semiconductor packaging companies and SMT packaging companies.

We are collaborating with semiconductor and semiconductor packaging companies to create new products so that consumers can enjoy the digital age.

■ Please introduce the equipment and solutions being presented at Semicon Korea 2026.

Korea's semiconductor industry has grown explosively in recent years. ASMPT has helped with this in Korea over the past few years.

This year, we introduced solutions to help customers effectively capture the growth of this industry.

We will help customers grow in this industry.

The ALSI 1206 laser diving rising grooving system was introduced at this exhibition.

The laser diving grooving system will assist semiconductor manufacturers in clean room environments close to clean rooms.

The system is equipped with a so-called automated cleanroom mini environment, which helps customers maintain more stable yields while effectively capturing the rapid growth opportunities of the AI industry.

In addition, MEGA equipment and DALA equipment are also being showcased.

The MEGA equipment is a multi-chip module (MCM) system that supports customers in performing various tasks and is basically composed of two models.

We are offering both the G and P models, which support not only the photonics field but also multi-chip module (MCM) assembly.

As the so-called 'boom' in the current AI industry continues, large-scale connectivity is becoming an essential requirement, and MEGA systems play a crucial role in meeting these demands.

Among the equipment being introduced with us today is the DALA machine.

The solution provided this time is applied to the CIS (so-called CMOS image sensing) field and supports customers in performing both die attach and land attach processes.

In the field of artificial intelligence, not only is the 'brain' responsible for thinking—that is, the chip—important, but sensing is also very important.

this timeThe solution we are introducing supports the implementation of a camera module capable of collecting all necessary information existing in the physical world, and the collected data is input into an AI system to help derive the optimal solution for the customer.


■ How do you view the future semiconductor market, and what does ASMPT expect from the Korean market?

The Korean semiconductor market continues to develop. Its popularity is rising due to the advancement of AI.

Korea is one of the major customers for the ultra-high-speed memory required for AI. The Korean government believes that awareness of AI is important.

Furthermore, the Korean government is further strengthening its efforts regarding the semiconductor market. In particular, it is focusing on supply chains and system design.

We will further strengthen our efforts regarding the Korean semiconductor market.

As we all know, awareness of AI is growing. I believe this trend will not stop anytime soon.

We will further strengthen our efforts regarding the Korean semiconductor market.