As competition intensifies to develop high-performance memory, a key component in the AI era, Applied Materials and SK Hynix have joined hands to jointly develop next-generation AI memory.

Applied Materials announced on the 11th that it has formed a long-term partnership with SK Hynix to jointly research and develop next-generation DRAM and HBM technologies.

The two companies will strengthen their collaboration centered around Applied's EPIC (Equipment and Process Innovation and Commercialization) Center currently under construction in Silicon Valley, and jointly pursue an innovation roadmap to respond to the expansion of AI infrastructure.

As the computational load of AI systems has recently exploded, memory speed and power efficiency have emerged as key challenges for the semiconductor industry.

SK Hynix CEO Kwak No-jeong emphasized, “The biggest obstacle to improving AI performance is the speed gap between processors and memory,” and “To solve this, faster and more efficient memory technology is essential.”

This collaboration is a strategic choice to address these industrial needs, and both companies We are driving innovation across all areas of memory, from new material exploration to process integration and 3D packaging.

Applied Materials is dramatically revolutionizing its semiconductor equipment and process R&D methods through its EPIC Center, scheduled to open this year.

The $5 billion center is considered the largest semiconductor equipment research investment in the United States.

SK Hynix engineers will reside at the EPIC Center and collaborate directly with Applied Technologies' technical staff. This will accelerate the validation of new technologies and shorten the time to mass production.

“Our two companies have a long history of working together on materials engineering-based memory innovation,” said Gary Dickerson, CEO of Applied Materials. “Our collaboration at the EPIC Center will be a significant turning point in accelerating the commercialization of next-generation DRAM and HBM.”

Initial joint research will focus on new material development, process integration technology, and HBM-level advanced packaging.

SK Hynix CTO Cha Seon-yong explained, “In the era of AI memory, existing wafer fab equipment development methods have limitations,” and “A new approach is needed across all areas, including new materials, thermal management, and packaging.”

SK Hynix also plans to leverage Applied Materials' advanced packaging research infrastructure located in Singapore to pursue integrated innovation linking device design and packaging technology.