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Applied Materials and TSMC Strengthen Joint Research in Silicon Valley… Driving Development of Next-Generation Semiconductor Processes
Aiming to expand cooperation based on the EPIC Center and shorten the development cycle from research to mass production.
Applied Materials announced on May 12 that it is collaborating with TSMC on semiconductor process and equipment development at the Silicon Valley EPIC Center.
This collaboration is interpreted as reflecting the rapidly increasing difficulty of process technology amidst rising semiconductor performance demands driven by the proliferation of artificial intelligence. The analysis suggests that as microfabrication approaches its limits, an approach that simultaneously considers materials, equipment, and the entire process—rather than focusing on improvements in a single step—has become necessary.
The two companies are reviewing process technologies capable of simultaneously achieving performance enhancements and energy efficiency improvements in advanced logic technology. They also plan to jointly explore the applicability of new materials and equipment for forming transistors and wiring structures that are becoming increasingly complex. Technologies for yield stabilization and process deviation management, which have become increasingly important with the expansion of stacked structures, are also included in the scope of the joint research.
Applied Materials believes that consolidating the research personnel of both companies into one space will accelerate technology verification and improve the efficiency of process development. TSMC also explained that as semiconductor structures evolve, process integration capabilities are becoming increasingly important, and a collaborative research environment is necessary for this purpose.
The EPIC Center is a large-scale semiconductor equipment research facility designed to shorten the process from initial technology verification to mass production application. Participating companies will utilize an environment through this facility that enables them to secure process data early and reduce development iteration cycles.
The industry views this collaboration as an example of a trend shifting away from competition centered on individual companies toward technology development based on cooperation. In particular, as the challenge of simultaneously improving semiconductor performance and power efficiency grows due to expanding demand for AI, analysts suggest that joint research models are likely to become more widespread in the future.
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