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Measurement in the HBM era: The key is whether the measurement changes the signal.
Published2026.05.22 13:43According to Mohamed Hafed, CEO of Introspect Technology, who presented next-generation DDR/LPDDR memory analysis solution (Introspect) at the e4ds & Jays webinar on May 19, the core of HBM and next-generation memory measurement is a probing structure that does not distort signals and traffic analysis based on actual operation. JEDEC standard-based command and timing verification, frequency and clock change detection, and accurate measurement location and calibration procedures are essential elements for precise analysis.
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Semiconductor investment momentum shifts from front-end to back-end
The flow of semiconductor investment is shifting from front-end to back-end and packaging-focused processes. Global companies are concentrating on HBM stacking, testing, and supply chain localization, similar to SK Hynix's Indiana HBM packaging factory, with back-end equipment and packaging industries expected to reach peak demand by 2027.
2026.08.28by 배종인 기자
AI Agents Trigger 'Memory Supercycle'
At the 'Dell Technologies Forum 2026', SK Hynix Vice President Joo Young-pyo emphasized that as AI proliferation advances, memory bandwidth and efficiency emerge as critical bottlenecks, and SK Hynix must address this through HBM, 3D packaging, PIM, CXL, and memory pooling. As generative and inference-type AI increase, TB-level memory capacity, high-speed bandwidth, and sophisticated data processing have become essential, and a transition from GPU-centric architecture to memory-centric architecture is underway. HBM demand is surging rapidly, with memory efficiency, computational optimization, and system integration identified as key competitiveness factors for AI.
2026.08.28by 배종인 기자
SK Hynix Breaks Ground on U.S. Indiana HBM Production Base...Mass Production of 'Made in USA' HBM in 2029
SK Hynix announced that it held a groundbreaking ceremony on the 27th (local time) for an advanced packaging production facility for AI memory in West Lafayette, Indiana, USA. The project will receive an investment of over 4 billion dollars. The production facility aims to complete its cleanroom by October 2028, and is scheduled to begin mass production of next-generation HBM from the second half of 2029.
2026.08.28by 배종인 기자
Lam Research Breaks Ground on New R&D Facility in Oregon
Lam Research held a groundbreaking ceremony for a new R&D center at its Tualatin campus in Oregon to respond to growing demand for AI semiconductor development. As the first project under a five-year, $3 billion investment plan, this project spans approximately 11,000 square meters and is scheduled for completion in 2028, with plans to expand cleanroom space by more than 50%. The initiative is expected to strengthen capabilities in advanced deposition and etch processes, materials science, and hardware validation while supporting closer collaboration with customers.
2026.08.28by 배종인 기자
가트너 “2026년 메모리 매출 8,373억 달러… 전년비 280% 급증”
가트너가 2026년 전 세계 반도체 시장이 1조 5,552억 달러에 이를 것으로 전망했다. AI 인프라 투자 확대와 메모리 가격 상승이 주요 성장 동력이며, 메모리 부문 매출이 8,373억 달러로 전체의 54%를 차지할 것으로 예상된다. DRAM과 NAND 매출은 각각 246%, 371% 증가하고, HBM 수요도 함께 급증할 전망이다.
2026.08.25by 명세환 기자
