SK Hynix has unveiled 'iHBM' technology, which reduces heat generation by incorporating cooling elements inside the HBM package. The company plans to enhance the operational stability of next-generation HBM under high temperatures and heavy loads by creating a separate heat dissipation path within the package.

On the 26th, SK Hynix announced iHBM technology, which incorporates an integrated cooling element called 'ICE' into the HBM package. ICE is a structure that creates additional heat dissipation channels inside the package by utilizing silicon material with low electrical conductivity and high thermal conductivity.

As the demand for AI computing has increased, HBM has evolved by stacking more memory dies and increasing data processing speeds. In this process, the D2D PHY section connecting the GPU and HBM is an area where data movement is concentrated, making thermal density management a major technological challenge.

Conventional HBM relied primarily on an indirect method of dissipating heat to the outside through the core die. iHBM creates a dedicated path for heat to escape by placing the ICE within the D2D PHY area where heat is concentrated. SK Hynix explained that through this, it lowered thermal resistance by more than 30% compared to the existing level.

Mass production applicability was also considered. The company applied an Advanced MR-MUF-based WLP process to iHBM. MR-MUF is a packaging process that enhances structural stability by filling the spaces between stacked chips with a protective material, a method that SK Hynix has been using for HBM production.

From the customer's perspective, compatibility with existing SiP environments is crucial. SK Hynix stated that iHBM offers high compatibility with existing System Integrated Package designs, allowing it to be implemented without significant design changes. This can help reduce the burden of verification and design modifications during the adoption of next-generation memory.

The HBM market is shifting towards a structure that requires bandwidth, power efficiency, and thermal management together, driven by the demand for AI data centers and high-performance computing. As the number of memory layers and operating speeds increase, internal package thermal control has a direct impact on system stability and operational efficiency.

SK Hynix plans to apply iHBM technology starting with next-generation products such as HBM5. Lee Kang-wook, Vice President of SK Hynix (Head of PKG Development), stated, “iHBM is a heat minimization solution developed by combining memory design capabilities with advanced packaging technology.”